PCB Depanel Stress Control: Separating Without Damage Breaking boards out of a panel looks like the simplest step in the whole build. It is also the step where a hidden crack can enter a ceramic capacitor or a solder joint. Depanel stress control is the discipline of keeping bending and…

PCB Laser Marking Versus Ink: How the Mark Is Made Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB laser marking versus ink from the perspective of a…

PCB Barcode Readability: Making It Scan First Time Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB barcode readability from the perspective of a PCBA factory floor, covering…

PCB Unit Level Traceability: Each Board on Its Own Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB unit level traceability from the perspective of a PCBA factory…

PCB Threaded Insert Installation: Putting a Nut in the Board Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB threaded insert installation gives you a practical…

PCB Pin in Hole Reflow: Soldering a Connector by Reflow Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB pin in hole reflow gives you a…

PCB Corner Staking: Holding the Corners Down Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB corner staking from the perspective of a PCBA factory floor, covering adding…

BGA Underfill Process: Filling Under the Package Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding BGA underfill process gives you a practical advantage when you choose…

PCB Component Standoff Height: Lifting the Part Off the Board Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB component standoff height from the perspective of a PCBA…

PCB Capillary Solder Flow: How Solder Climbs Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB capillary solder flow gives you a practical advantage when you…