PCB Assembly

Choosing Copper Weight for Power and High Current Boards

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Choosing Copper Weight for Power and High Current Boards Copper weight is one of the first numbers a designer chooses and one of the last to be questioned, yet it drives current capacity, thermal behaviour, etch capability and cost at the same time. Specifying one ounce when the board carries…

Low-Volume PCB Assembly and Prototype Runs

Reflow Oven Flux Condensate and Maintenance

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Reflow Oven Flux Condensate and Maintenance A reflow oven runs for weeks with flux vapour condensing inside it. The residue collects on the chamber walls, the heaters, the conveyor and the cooling section, and it changes the way the oven behaves long before it becomes visible on a board. Oven…

Selective Coating Robot Path Programming

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Selective Coating Robot Path Programming Selective coating applies material only where it is wanted, using a robot or a gantry to move a dispense valve along a programmed path. It avoids the masking that spraying and dipping require, and it puts the coating exactly on the areas the design identified.…

Electroformed Stencil: Electroformed vs Laser Cut Stencils

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Electroformed Stencil: Electroformed vs Laser Cut Stencils A stencil is a consumable tool that sets the deposit on every joint of every board it produces. Two manufacturing routes dominate: laser cutting a stainless foil, and electroforming nickel onto a mandrel so that the aperture grows to its final shape. They…

Alloy Selection for Fine Pitch Solder Paste

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Alloy Selection for Fine Pitch Solder Paste A fine pitch joint holds a very small volume of alloy, and that changes the requirements on the paste. Printability, powder size and flux activity all matter more than they do at a coarse pitch, and the alloy itself has to be chosen…

Solder Preform Application Methods: Design Rules, Flux and Reflow

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Solder Preform Application Methods: Design Rules, Flux and Reflow A solder preform is simply a shaped piece of alloy placed into a joint before heating. In power assemblies, where joints are large, metal is thick and thermal paths are heavy, that simple idea solves problems that paste alone cannot. Preforms…

PCB Placement Nozzle Sample: Checking a Small Piece

By 杰夫
2026年 9月 13日
PCB Assembly
No Comments

PCB Placement Nozzle Sample: Checking a Small Piece A placement nozzle sample is a small, low-cost check that tells you how a pick-and-place head handles one component. It is not a full board, and it is not a production run. It is a controlled trial of a nozzle, a part…

Loss Tangent: Design Rules and Process Limits

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Loss Tangent: Design Rules and Process Limits Two numbers on a laminate datasheet decide how much a high speed channel loses: the dielectric constant and the loss tangent. The first sets the impedance and the propagation velocity, the second sets how much energy the material absorbs. Choosing a laminate is…

Dispensing Nozzle Choices for Paste Jetting

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Dispensing Nozzle Choices for Paste Jetting Solder paste jetting applies paste without a stencil, using a valve to fire small deposits onto the pads as the board moves underneath. It exists because some products cannot be printed: boards with severe height variation, assemblies where a stencil cannot be supported, small…

Flexible Circuit Dynamic Bend Design Rules

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Flexible Circuit Dynamic Bend Design Rules A flexible circuit that is bent once during assembly is a different design problem from one that bends ten thousand times in service. Repeated bending accumulates fatigue damage in the conductors, and the design rules that allow a single form will fail quickly under…

Choosing Copper Weight for Power and High Current Boards

Reflow Oven Flux Condensate and Maintenance

Selective Coating Robot Path Programming

Electroformed Stencil: Electroformed vs Laser Cut Stencils

Alloy Selection for Fine Pitch Solder Paste

Solder Preform Application Methods: Design Rules, Flux and Reflow

PCB Placement Nozzle Sample: Checking a Small Piece

Loss Tangent: Design Rules and Process Limits

Dispensing Nozzle Choices for Paste Jetting

Flexible Circuit Dynamic Bend Design Rules

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