PCB Prepreg Problems: A Factory-Floor Review Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB prepreg problems from the perspective of a PCBA factory floor, covering troubleshooting prepreg…

Non Wet Open Defects Explained A non wet open is a joint where the solder never bonded to the pad at all. The solder may sit on the surface, it may have formed a ball beside the pad or it may appear to have covered it, but the interface is…

Bottom Terminated Components: Placement and Reflow Guide Bottom terminated components cover a wide family: quad flat no lead packages, dual flat no lead parts, land grid arrays and the many power packages whose only connection is a pad underneath the body. They are attractive because they are small and because…

PCB Prepreg Traceability: From Design to Repeatable Production Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB prepreg traceability from the perspective of a PCBA factory floor, covering…

PCB Prepreg Environment: Design, Process, and Quality Notes Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB prepreg environment from the perspective of a PCBA factory floor, covering…

Impedance Controlled Stackup Design Impedance control means that the characteristic impedance of a trace is specified as a number and built to a tolerance, rather than being accepted as whatever the geometry happens to give. It matters for every interface that has a specification attached, from a single ended clock…

Component Placement Accuracy in SMT Placement accuracy is the difference between where a component was intended to be and where it actually landed. It is quoted as a machine specification, but the number that reaches the board is the sum of several contributions, and only some of them belong to…

PCB Prepreg Specification: Design and Assembly Considerations Modern electronics depend on boards that are assembled correctly the first time. Every product – a phone, a charger, a medical instrument or an industrial controller – relies on thousands of solder joints that must conduct current for years. This article explains PCB…

PCB Prepreg Handover: Process Details and Inspection Points Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB prepreg handover from the perspective of a PCBA factory floor, covering…

PCB Prepreg Timing: Process Details and Inspection Points Modern electronics depend on boards that are assembled correctly the first time. Every product – a phone, a charger, a medical instrument or an industrial controller – relies on thousands of solder joints that must conduct current for years. This article explains…