6G RF PCB Design: Sub-THz Constraints Reach Phone Programs Early On September 4, 2026, industry reporting indicated that European CE-RED requirements are extending radio frequency compatibility validation for high end AI smartphones further into the 6G sub-terahertz bands, and are bringing RF front end modules, full-device coexistence testing and certification…

ABF Substrate Price Increase and the Material Bottleneck Behind AI On September 8, 2026, market reporting drew attention back to ABF material upstream of IC substrates. Ajinomoto produces ABF, the key interlayer insulating material used in high performance semiconductor package substrates, and company information indicates its global market share exceeds…

PTFE PCB Material and the AI Backplane Material Race Through August 2026, a shift in the material roadmap for NVIDIA’s Rubin Ultra orthogonal backplane became a focus of supply chain attention. Information from multiple research institutions and industry sources indicates that the backplane program is evaluating and advancing PTFE-based material…

Medical Wearable PCB: Why Smartwatch Precision Keeps Rising The US FDA cleared Apple’s Hypertension Notification Feature through the 510(k) pathway for Apple Watch Series 9 and later and Apple Watch Ultra 2 and later. The feature does not measure blood pressure directly. It uses data collected by the optical heart…

AI Glasses FPC and Micro HDI: Manufacturing at Ten Million Units Through September 2026, the AI glasses industry has visibly accelerated in both capitalization and scale. Industry information indicates that more than 65 new AI glasses products were launched globally in the first half of the year, XREAL has advanced…

Foldable Phone FPC: From Static Connector to Dynamic Component On the morning of September 10, 2026 Beijing time, Apple officially released its first foldable phone, the iPhone Duo. The device uses a book-style fold with a 7.6 inch inner display when opened and a 5.4 inch outer display when closed,…

mSAP Optical Module PCB: The 1.6T Bottleneck Nobody Plans For Through September 2026, demand for 800G and 1.6T optical modules has continued to intensify, and PCB manufacturers have begun accelerating mSAP capacity expansion in response. One major supplier has been building optical module mSAP lines simultaneously in three locations, with…

Localization and New EV Trends Reshape Automotive PCB Demand Against the dual background of continuously rising new energy vehicle penetration and the advancement of supply chain autonomy and controllability strategy, the automotive PCB industry has not only ushered in demand scale expansion, but also a clear iterative direction for technology…

PCB DDR Termination: From Prototype to Volume Production Modern electronics depend on boards that are assembled correctly the first time. Every product – a phone, a charger, a medical instrument or an industrial controller – relies on thousands of solder joints that must conduct current for years. This article explains…

PCB DDR Routing Length Rules: Matching the Data Lines Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB DDR routing length rules gives you a practical…