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Via Design in High-Speed PCB Layout: Parasitics and Stubs

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Via Design in High-Speed PCB Layout: Parasitics and Stubs A via looks like a simple connection between two layers, and electrically it is anything but simple. Every via adds capacitance to the net it joins, adds inductance to the return path around it, and creates a stub that reflects energy…
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PCB Board Thickness Tolerance Control: Holding the Dimension

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Board Thickness Tolerance Control: Holding the Dimension Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB board thickness tolerance control gives you a practical advantage…
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PCB Stackup Symmetry Rules: Keeping the Board Flat

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Stackup Symmetry Rules: Keeping the Board Flat Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB stackup symmetry rules from the perspective of a PCBA factory floor,…
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PCB Layer to Layer Registration: Lining the Layers Up

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Layer to Layer Registration: Lining the Layers Up Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB layer to layer registration gives you a practical…
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Patient Monitor PCBA

PCB Prepreg Storage Life: Keeping the Resin Fresh

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Prepreg Storage Life: Keeping the Resin Fresh Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB prepreg storage life from the perspective of a PCBA factory floor,…
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PCB Loss Tangent Test Method: How Much the Material Eats

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Loss Tangent Test Method: How Much the Material Eats Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB loss tangent test method from the perspective of a…
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PCB Lamination Wrinkles and Resin Flow: When the Resin Moves Too Far

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Lamination Wrinkles and Resin Flow: When the Resin Moves Too Far Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB lamination wrinkles and resin flow…
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5 Key Stages of PCB Prototype Manufacturing

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
5 Key Stages of PCB Prototype Manufacturing Almost everyone who works with electronics knows what a printed circuit board is, and far fewer know how one is actually built. Modern boards are constructed with a pattern plating process, in which copper is plated onto the areas that will become conductors…
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HMI & Embedded Controller PCBA

Multilayer PCB Design Tolerances Explained

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Multilayer PCB Design Tolerances Explained Every dimension on a fabrication drawing carries a tolerance, and every tolerance costs money to hold. The skill in a multilayer design is not to demand the tightest value everywhere, but to identify the few dimensions where accuracy actually matters and to leave the rest…
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OSP Surface Finish: Process and Protection

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
OSP Surface Finish: Process and Protection Copper oxidises. A bare copper pad that has been exposed to air for a few days will not wet properly when solder is applied, and the resulting joint is weak and unreliable. Preventing that means covering the copper until the moment of assembly, and…
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