Wave Soldering

Mixed Technology Assembly: Best of Both

By Lucy Yang
2026年 9月 9日
PCB Assembly
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Mixed Technology Assembly: Best of Both Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at mixed technology assembly from the perspective of a PCBA factory floor, covering through hole…

Through Hole Assembly: When It Is Still Needed

By Lucy Yang
2026年 9月 9日
PCB Assembly
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Through Hole Assembly: When It Is Still Needed Modern electronics depend on boards that are assembled correctly the first time. Every product – a phone, a charger, a medical instrument or an industrial controller – relies on thousands of solder joints that must conduct current for years. This article explains…

Through Hole vs SMT: Choosing the Right Method

By Lucy Yang
2026年 9月 9日
PCB Assembly
No Comments

Through Hole vs SMT: Choosing the Right Method Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at through hole vs SMT from the perspective of a PCBA factory floor,…