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PCB Testing

FPC Structure Design: Layers, Coverlay and Stiffeners

  • By Frank guo
  • 2026年 9月 16日
  • PCB Assembly
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FPC Structure Design: Layers, Coverlay and Stiffeners A flexible circuit is often treated as a flat cable with chips on it. In practice, FPC structure design decides almost everything about the finished part: how many times it can bend, how much current it can carry, whether it survives reflow and…
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Radar PCB

PCBA Manufacturer Selection: A Practical Evaluation Framework

  • By Frank guo
  • 2026年 9月 16日
  • PCB Assembly
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PCBA Manufacturer Selection: A Practical Evaluation Framework Search for a contract electronics partner and the first results are usually ranking tables. They are easy to read and almost useless, because PCBA manufacturer selection depends far more on your product than on someone else position in a list. The right question…
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SMD vs Through-Hole Components

HDI PCB Applications: From Phones to Servers and Vehicles

  • By Frank guo
  • 2026年 9月 16日
  • PCB Assembly
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HDI PCB Applications: From Phones to Servers and Vehicles The clearest way to understand HDI PCB applications is to notice what they have in common. Every one of them involves a device that must be smaller, faster or denser than the previous generation, and every one of them reaches the…
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Medical PCB Manufacturing: Standards Beyond the Cleanroom

  • By Frank guo
  • 2026年 9月 16日
  • PCB Assembly
  • No Comments
Medical PCB Manufacturing: Standards Beyond the Cleanroom Discussion of medical electronics often reduces to a single number, such as the cleanliness class a factory claims. Real medical PCB manufacturing is judged on something broader: whether material, process, environment and records are controlled together, in a way that can be audited…
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Medical PCB Manufacturing

Foldable Phone FPC: Why Hinge Interconnect Is Getting Harder

  • By Frank guo
  • 2026年 9月 16日
  • PCB Assembly
  • No Comments
Foldable Phone FPC: Why Hinge Interconnect Is Getting Harder Foldable phones stopped being a niche category the moment three major brands began competing for the same buyers. Panel shipments are expected to grow by roughly a quarter in 2026, and the mix is shifting toward larger book style devices that…
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PCB Prototype

Optical Module PCB: mSAP, 800G and the High Speed Shift

  • By Frank guo
  • 2026年 9月 16日
  • PCB Assembly
  • No Comments
Optical Module PCB: mSAP, 800G and the High Speed Shift Optical interconnect used to sit at the edge of the data centre discussion. It now sits at the centre of it, because adding accelerators without adding bandwidth simply moves the bottleneck. That shift has turned the optical module PCB into…
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PCB Supplier

PCB Drilling Process: Mechanical Versus Laser Drilling

  • By Frank guo
  • 2026年 9月 16日
  • PCB Assembly
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PCB Drilling Process: Mechanical Versus Laser Drilling Every hole in a circuit board is a decision about how the board will be built. The PCB drilling process sets the smallest feature the design can use, the registration window the layers must meet, and a large part of the cycle time…
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AI Glasses PCB Design: FPC, Rigid Flex and Micro HDI

  • By Frank guo
  • 2026年 9月 16日
  • PCB Assembly
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AI Glasses PCB Design: FPC, Rigid Flex and Micro HDI When a software platform is ported to smart glasses, the hardware has to absorb a new workload without gaining a single gram. An AI glasses PCB must therefore support continuous voice interaction, camera input, display output and wireless traffic inside…
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Millimeter Wave Radar PCB Manufacturing at 77GHz

  • By Frank guo
  • 2026年 9月 16日
  • PCB Assembly
  • No Comments
Millimeter Wave Radar PCB Manufacturing at 77GHz When a radar chip reaches volume production with eight transmit and eight receive channels, the antenna board behind it stops being a supporting component and becomes part of the sensor itself. A millimeter wave radar PCB operating near 77GHz is judged by the…
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High Precision RF PCB Manufacturing From 5G-A to 6G

  • By Frank guo
  • 2026年 9月 16日
  • PCB Assembly
  • No Comments
High Precision RF PCB Manufacturing From 5G-A to 6G Telecom investment plans rarely name circuit boards, yet the numbers behind them decide which factories stay busy. A spending programme covering information infrastructure through 2030 puts high precision RF PCB manufacturing at the centre of the next upgrade cycle, alongside compute…
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PCB Packaging Materials: ESD and Mechanical Protection Guide

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PCB Packaging for Thin and HDI Boards: ESD and Damage Prevention

PCB Packaging for Thin and HDI Boards: ESD and Damage Prevention

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