CO₂ Laser Drilling Process Methods for HDI PCBs Keywords: CO₂ laser drilling, HDI PCBs, microvias, copper window, RCC (Resin Coated Copper), dielectric layer, ultra-thin copper foil, desmear process Overview of CO₂ Laser Drilling for HDI PCBs With the continuous development of high-density electronic products, the requirements for miniaturization, high-speed signal…

In the field of component interconnection technology for electronic products, printed circuit boards (PCBs) are widely used as the fundamental platform for connecting and supporting electronic components. With the continuous increase in the packaging density of modern electronic and electromechanical components, the requirements for printed circuit boards (PCBs) are becoming…