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Tin Stripping and Copper Surface Protection

  • By Frank guo
  • 2026年 9月 14日
  • PCB Assembly
  • No Comments
Tin Stripping and Copper Surface Protection Tin stripping removes the tin or tin-lead layer from the copper that has been plated over, so that the underlying copper becomes the finished conductor after etching. It is used with pattern plating, where a metal resist is plated up and then stripped away,…
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Alkaline Resist Stripping Control in PCB Fabrication

  • By Frank guo
  • 2026年 9月 14日
  • PCB Assembly
  • No Comments
Alkaline Resist Stripping Control in PCB Fabrication Resist stripping removes the plating resist and the etch resist from a panel after the copper has been defined, and the step has to do it without attacking the copper, the solder mask or the laminate. The chemistry is alkaline, the reaction is…
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Plating Bath Dilution: 5 Checks for Correct Concentration

  • By Frank guo
  • 2026年 9月 14日
  • PCB Assembly
  • No Comments
Plating Bath Dilution: 5 Checks for Correct Concentration Plating bath dilution happens whenever water enters a tank faster than it leaves. Rinsing drags water in, panels carry it on their surfaces, and evaporation is the only natural way out. When dilution outpaces evaporation the bath weakens, plating slows and operators…
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Copper Loading Control: 5 Rules for Plating Area Balance

  • By Frank guo
  • 2026年 9月 14日
  • PCB Assembly
  • No Comments
Copper Loading Control: 5 Rules for Plating Area Balance Copper loading control is the arithmetic that decides what every panel in a tank actually receives. Copper loading sets how much surface the rectifier has to serve, and when it drifts the deposit thins on some parts and thickens on others.…
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High-Speed PCB Design

Iron Contamination in Plating: 5 Sources to Shut Down

  • By Frank guo
  • 2026年 9月 14日
  • PCB Assembly
  • No Comments
Iron Contamination in Plating: 5 Sources to Shut Down Iron contamination in plating is slow, cumulative and easy to miss. Iron enters a bath in small amounts from parts that were never meant to be in it, and once the level rises the deposit turns dull, stressed and brittle. Five…
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Brightener Consumption Control: 5 Checks for Even Copper

  • By Frank guo
  • 2026年 9月 14日
  • PCB Assembly
  • No Comments
Brightener Consumption Control: 5 Checks for Even Copper Brightener consumption is the additive variable that changes fastest in an acid copper bath and the one most often managed by feel. Brighteners are consumed by deposition itself, by drag out and by oxidation, so their concentration falls continuously during production while…
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Pumice Scrub Surface Preparation Before Coating

  • By Frank guo
  • 2026年 9月 14日
  • PCB Assembly
  • No Comments
Pumice Scrub Surface Preparation Before Coating A pumice scrub is a mechanical surface preparation in which a slurry of fine abrasive is brushed across the copper to remove oxide, contamination and a small amount of metal before a coating step. It is used ahead of solder mask, before dry film…
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PCB TDR Measurement Records: Writing It Down

  • By 杰夫
  • 2026年 9月 14日
  • PCB Assembly
  • No Comments
PCB TDR Measurement Records: Writing It Down Modern electronics depend on boards that are assembled correctly the first time. Every product – a phone, a charger, a medical instrument or an industrial controller – relies on thousands of solder joints that must conduct current for years. This article explains PCB…
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PCB Impedance Coupon Specification: Writing It Down Precisely

  • By 杰夫
  • 2026年 9月 14日
  • PCB Assembly
  • No Comments
PCB Impedance Coupon Specification: Writing It Down Precisely Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB impedance coupon specification gives you a practical advantage when…
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PCB TDR Measurement Audit: Checking the Practice

  • By 杰夫
  • 2026年 9月 14日
  • PCB Assembly
  • No Comments
PCB TDR Measurement Audit: Checking the Practice Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB TDR measurement audit gives you a practical advantage when you…
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