PCB Breakaway Tab Review: A Second Look Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB breakaway tab review from the perspective of a PCBA factory floor, covering…

PCB Panel Size Audit: Checking the Practice Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB panel size audit from the perspective of a PCBA factory floor, covering…

PCB Breakaway Tab Risks: What Could Go Wrong Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB breakaway tab risks gives you a practical advantage when…

PCB Panel Size Records: Writing It Down Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB panel size records gives you a practical advantage when you…

DI Water Resistivity Control in the Final Rinse Resistivity is the resistance of water to carrying an electric current, and in a PCB final rinse it is used as a continuous indicator of how much dissolved ionic material the water is still picking up. Deionised water with nothing dissolved in…

Selective Soldering Flux Volume and Deposition Control Flux volume is the quantity of activator and vehicle that reaches a joint before the solder does, and in selective soldering it is the least visible part of the process and the most common cause of a joint that fills badly. Unlike wave…

Peck Drilling Deep Holes on High Aspect Ratio Boards Peck drilling is a drilling cycle in which the bit advances, retracts partly or fully, and advances again until the hole is complete. It is used for deep holes on thick boards, where a single continuous stroke would leave chips packed…

Solder Mask Tack Dry Control Before Exposure Tack dry is the short bake that follows solder mask printing and precedes exposure, and it is the step that decides whether the coating can be imaged cleanly. Its job is to remove most of the solvent from the film so that it…

Stencil Separation Speed and Paste Release Control How the Stencil Leaves the Board After the squeegee has pushed paste into the apertures, the stencil has to be pulled away from the board while the paste stays behind. On most printers the board drops away on a support plate or the…

SPI Measurement Repeatability and Gauge Studies Solder paste inspection produces a number for every pad on a panel, and the value of that number depends entirely on how much of it is measurement and how much is noise. Repeatability is the part of the variation that comes from the machine…