Hyperscale Data Centre PCB: Design for High Density Systems A data centre PCB is designed against a set of constraints that ordinary server boards do not face at the same intensity. The board has to carry very high speed serial links across a long backplane, deliver hundreds of amps at…

PCB Nozzle Selection for Placement: The Right Tip for the Part Modern electronics depend on boards that are assembled correctly the first time. Every product – a phone, a charger, a medical instrument or an industrial controller – relies on thousands of solder joints that must conduct current for years.…

PCB Squeegee Pressure and Angle: From Design to Repeatable Production Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB squeegee pressure and angle from the perspective of a…

PCB Placement Force on A Fine Pitch Part: What Buyers and Engineers Should Check Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB placement force on…

PCB Solder Paste Inspection After Print: What Buyers and Engineers Should Check Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB solder paste inspection after print…

Transportation IoT Board: Design Guide for Vehicle Systems An IoT board that is installed in a transport system has a harder life than one that sits on a desk. It is powered from a vehicle supply that is never clean, it is mounted where it is shaken, it must operate…

Machine Vision PCB: Sensor Interface and Power Noise A machine vision board exists to move image data from a sensor to a processor without corrupting it. That sounds simple, and it becomes difficult because the data rate is high, the sensor is sensitive to its supply and its clock, and…

Press-Fit Connector PCB: Hole Design and Assembly Requirements A press-fit connector is attached by pushing pins into plated through holes instead of soldering them. The joint relies on mechanical interference: the pin compresses against the barrel wall and creates a gas-tight contact that carries current and holds the connector in…

IC Package Substrate: Structure, Materials and Build-Up Layers An IC package substrate is the board that carries a bare die and connects its micrometre scale bumps to millimetre scale board pads. It redistributes power, ground and high speed signals, manages heat, and protects the device during assembly. As packages have…

Heavy Copper PCB Prototyping: Design Rules and Process Control Heavy copper PCB work starts where conventional boards stop: above about 3 oz of finished copper per layer. The thicker metal carries far more current, spreads heat under power devices and survives mechanical stress better, but it also changes every process…