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27

Conveyor Roller Maintenance: 6 Checks on Wet Process Lines

  • By Frank guo
  • 2026年 9月 14日
  • PCB Assembly
  • No Comments
Conveyor Roller Maintenance: 6 Checks on Wet Process Lines Conveyor roller maintenance is the least glamorous job on a wet process line and one of the most valuable. Rollers set panel speed, control how long a panel spends in each spray zone, and hold the panel flat so chemistry reaches…
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Smart Meter PCBA

Solder Mask Ink Color Control: 6 Steps for Consistent Batches

  • By Frank guo
  • 2026年 9月 14日
  • PCB Assembly
  • No Comments
Solder Mask Ink Color Control: 6 Steps for Consistent Batches Solder mask ink color is a cosmetic property that customers treat as a quality property, and it has real technical consequences as well. Pigment loading changes viscosity, cure behavior and how completely the mask shadows ultraviolet light. Two panels that…
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Infusion Information Collection System PCBA

PCB Desmear Improvement: Getting Better Each Lot

  • By 杰夫
  • 2026年 9月 14日
  • PCB Assembly
  • No Comments
PCB Desmear Improvement: Process Details and Inspection Points Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB desmear improvement from the perspective of a PCBA factory floor, covering…
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714

Solder Float Test: Thermal Stress and Plated Hole Integrity

  • By Frank guo
  • 2026年 9月 14日
  • PCB Assembly
  • No Comments
Solder Float Test: Thermal Stress and Plated Hole Integrity The solder float test subjects a plated hole to a sudden thermal shock by floating a sample of the board on molten solder for a fixed time, then examining the barrel for cracks. It is one of the oldest reliability tests…
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Power Supply & Industrial Power

Deburring and Edge Finishing Control for PCB Routing: 5 Rules

  • By Frank guo
  • 2026年 9月 14日
  • PCB Assembly
  • No Comments
Deburring and Edge Finishing Control for PCB Routing: 5 Rules A burr is a raised lip of material left at the edge of a cut, and on a printed circuit board it can be made of laminate, of copper or of both. Burrs are produced whenever a cutting tool pushes…
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harsh-environment

Black Pad Defect Control on ENIG PCB Finishes: 6 Rules

  • By Frank guo
  • 2026年 9月 14日
  • PCB Assembly
  • No Comments
Black Pad Defect Control on ENIG PCB Finishes: 6 Rules Black pad is a defect that forms under the gold of an electroless nickel immersion gold finish, where the nickel layer has been attacked and converted into a brittle, phosphorus-rich corrosion product. The surface still looks like a normal pad,…
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AI and Smart Factory in PCB Manufacturing

Tab Routing Control for PCB Depaneling: 6 Rules

  • By Frank guo
  • 2026年 9月 14日
  • PCB Assembly
  • No Comments
Tab Routing Control for PCB Depaneling: 6 Rules Tab routing is a depaneling method in which the board is held in its panel by small bridges of laminate, and a router removes the material around the board while leaving those bridges until the last operation. The tabs are then cut,…
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PCB Warpag

Drill Bit Coating Selection: Tool Wear, Drill Life and Hole Quality

  • By Frank guo
  • 2026年 9月 14日
  • PCB Assembly
  • No Comments
Drill Bit Coating Selection: Tool Wear, Drill Life and Hole Quality A drill bit coating is a thin film deposited on the cutting edges and flutes of a carbide drill to slow the wear that limits its life. The benefit is not the same for every laminate: a coating that…
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16L Rogers4003+FR-4 TG170 PCB

Time to Delamination Testing: T260, T288 and Laminate Selection

  • By Frank guo
  • 2026年 9月 14日
  • PCB Assembly
  • No Comments
Time to Delamination Testing: T260, T288 and Laminate Selection Time to delamination is the period a laminate survives at a fixed elevated temperature before the resin separates from the glass reinforcement or from the copper foil. It is measured on a small sample in a thermal mechanical analyser, and the…
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HDI-PCB-design

Thick Copper Plating: Current Density and Plating Uniformity

  • By Frank guo
  • 2026年 9月 14日
  • PCB Assembly
  • No Comments
Thick Copper Plating: Current Density and Plating Uniformity Thick copper plating builds conductor layers of 70 micrometres and above, either to carry large currents or to spread heat away from power devices. The deposition is the same electrochemical process used for ordinary boards, but every tolerance becomes harder to hold:…
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Recent Posts

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Cheap PCB Costs: PCB Design, PCB Manufacturing & SMT vs TH Guide

Cheap PCB Costs: PCB Design, PCB Manufacturing & SMT vs TH Guide

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