Press-Fit: Design Rules and Process Limits A press-fit connector is installed by pushing a compliant pin into a plated through-hole that is smaller than the pin. The pin deforms elastically and presses against the barrel wall, and the resulting gas-tight contact carries the signal without any solder. The process looks…

PCB Hole Wall Quality Criteria And How To Measure Them A plated hole is the weakest structural element on most boards, and its quality is decided by a wall that cannot be seen without cutting the board open. Because the evidence is destructive, hole quality is judged through a combination…

PCB ESD Control Specification: From Design to Repeatable Production Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB ESD control specification gives you a practical advantage…

Conformal Coating Thickness Control and Verification Conformal coating is specified as a thickness for a reason: the film has to be thick enough to exclude moisture and ionic contamination for the life of the product, and thin enough that it does not crack, trap stress or interfere with connectors. A…

PCB ESD Control Sample: From Design to Repeatable Production Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB ESD control sample gives you a practical advantage…

Wave Solder Flux Application and Dross Control Practice Wave soldering succeeds or fails on two things that are easy to underestimate: how much flux reaches the board before it hits the wave, and how much dross has built up in the pot. Both change slowly, both are visible in the…

Adhesive Dispensing: Design Rules and Process Limits SMT adhesive exists for one reason: to hold components on the underside of a board while it passes over a wave. Everything about the process, from the dot size to the cure schedule, follows from that duty. The adhesive has to survive the…

PCB ESD Control Risks: What Matters on the Production Line Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB ESD control risks gives you a practical…

PCB ESD Control Data: What the Numbers Say Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB ESD control data gives you a practical advantage when…

PCB ESD Control Review: A Second Look Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB ESD control review gives you a practical advantage when you…