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Quick Turn PCB

Solenoid Driver and Flyback Protection

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Solenoid Driver and Flyback Protection A solenoid is an inductor with a mechanical load attached, and every time the driver turns it off, the stored energy has to go somewhere. The choice of where that energy goes decides how fast the valve releases, how much stress the switch sees, and…
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人形机器人PCBA

Press-Fit Pin Insertion Force and Plated Hole Control

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Press-Fit Pin Insertion Force and Plated Hole Control A press-fit joint replaces solder with mechanical interference, and the whole connection depends on dimensions that are measured in tens of micrometres. The compliant pin must deform enough to grip the barrel, the plated through hole must be tight enough to hold…
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AMR-Robot-PCBA

PCB Trace Inductance: The Opposition to Change

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Trace Inductance: Practical Process Controls Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB trace inductance from the perspective of a PCBA factory floor, covering estimating trace…
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BGA

PCB Pad Parasitic Capacitance: What the Pad Adds

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Pad Parasitic Capacitance: What the Pad Adds Modern electronics depend on boards that are assembled correctly the first time. Every product – a phone, a charger, a medical instrument or an industrial controller – relies on thousands of solder joints that must conduct current for years. This article explains…
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PCB Assembly

Rework Practice and Heat Control on Assembled Boards

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Rework Practice and Heat Control on Assembled Boards Correcting a defect on an assembled board is a repair, and the difference between a repair that lasts and one that returns is the control of heat. The techniques differ, and the same technique applied without control produces damage that appears later.…
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Industrial-control-assembly

PCB Trace Capacitance: The Charge a Track Holds

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Trace Capacitance: Design, Process, and Quality Notes Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB trace capacitance from the perspective of a PCBA factory floor, covering…
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PCBA Testing

PCB Single Ended Impedance: One Track, One Number

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Single Ended Impedance: A Practical Manufacturing Guide Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB single ended impedance from the perspective of a PCBA factory floor,…
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Wave-soldering-jpg

PCB Differential Pair Impedance: Holding the Target Number

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Differential Pair Impedance: Holding the Target Number A differential pair carries one signal on two traces, and the receiver reads the voltage difference between them. That arrangement rejects common-mode noise, but only while the pair holds its target impedance. The number is set by trace width, gap, copper thickness…
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ptt_sustainability

PCB Impedance Control And The TDR Test Report

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Impedance Control And The TDR Test Report Once a board carries a controlled impedance line, somebody has to prove that the value was met, and on anything faster than a low speed design that proof is a measurement rather than an assurance. The tool used for the measurement is…
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PCB Defects

Solder Ball and Bump Height Control in BGA Assembly

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Solder Ball and Bump Height Control in BGA Assembly Solder ball geometry is one of the most closely watched characteristics in modern BGA assembly. Every ball has to carry the right volume, sit at the right height, and hold a narrow window from reflow through final test. When bump height…
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