AI Chip Test Interfaces: Probe Cards and Burn-In Boards On September 10, 2026, supply chain reporting from DIGITIMES indicated that high end test interface capacity for AI chips remains tight. NVIDIA has reportedly locked up a substantial share of probe card and test socket capacity at major suppliers by paying…

PCB Accelerometer Placement: A Practical Manufacturing Guide Modern electronics depend on boards that are assembled correctly the first time. Every product – a phone, a charger, a medical instrument or an industrial controller – relies on thousands of solder joints that must conduct current for years. This article explains PCB…

Embedded Power Modules in PCB: SiC Packaging Moves On-Board Since the start of 2026, Silan Microelectronics has been building a patent portfolio around power module miniaturization, low stray inductance and embedded PCB structures. Records from the China National Intellectual Property Administration show that a design patent covering power devices for…

PCB Capacitive Touch Trace Design: Design and Assembly Considerations Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB capacitive touch trace design from the perspective of a PCBA…

PCB Touch Sensor Layout: A Practical Review for Manufacturing Teams Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB touch sensor layout gives you a practical…

eVTOL Airworthiness: What PCBA Reliability Really Requires In September 2026, the low-altitude economy development conference held in Wuhu, Anhui brought together aircraft manufacturers, supply chain companies and research institutions to discuss eVTOL airworthiness, volume production and commercial operation. The 2026 China eVTOL Industry Development White Paper, released alongside the event,…

PCB Photodiode and Ambient Light Sensor Layout: What Matters on the Production Line Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB photodiode and ambient light…

EIS Diagnostics in 26-Channel BMS Chips: PCB Design and Manufacturing On September 2, 2026, Texas Instruments introduced the BQ79826Z-Q1 battery monitor, a device that integrates electrochemical impedance spectroscopy diagnostics directly into a battery management monitoring chip. The part uses a 26-channel architecture, so four devices cover a 104-cell battery stack,…

The 2026 Automotive PCB Market in Global and China Numbers Latest industry estimates show that in 2026, the global automotive PCB market will firmly stand at the 10.5 billion US dollar mark. Relying on the scale of domestic new energy vehicle production and sales and the advantages of a complete…

TGV Glass Substrate and Advanced Packaging: PCB Manufacturing Guide The 2026 World Manufacturing Convention, scheduled for September 20 to 23 at the Hefei Binhu International Convention and Exhibition Center, will place automotive supply chain technology and semiconductor manufacturing side by side in a shared exhibition area of roughly 10,000 square…