PCB Balun Design: Converting Between Balanced and Unbalanced Modern electronics depend on boards that are assembled correctly the first time. Every product – a phone, a charger, a medical instrument or an industrial controller – relies on thousands of solder joints that must conduct current for years. This article explains…

Humanoid Robot PCB: Joint Electronics and Power Integration On August 28, 2026, Zhongjian Technology announced that the company and its controlling subsidiary Shanghai Huazhijian had signed an intelligent robot industrialization project investment agreement with the Yongkang Municipal People’s Government. The plan establishes a project implementation entity locally and builds an…

Ultra-Low-Power Medical Sensor PCBA for Multi-Parameter Wearables On September 3, 2026, the digital health industry continued to follow the FDA authorization of Abbott Libre Duo 10 Day. The FDA granted authorization on August 25 through the De Novo pathway for a continuous glucose and ketone monitoring system indicated for people…

PCB RF Filter Design: Passing One Band and Blocking the Rest Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB RF filter design gives you a…

Copper Inlay and Copper Pillar PCB Thermal Design for AI Chips Thermal data published in the PCB industry during August 2026 highlighted a problem that has been building for several years. As AI chip power consumption and power density continue to rise, localized peak heat flux has moved beyond 100…

PCB Antenna Matching Network: Tuning the Antenna Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB antenna matching network gives you a practical advantage when you…

6G Base Station PCB: Backplane Limits With 2048 Antenna Elements On August 18, 2026, industry information from the TD Industry Alliance and related sources confirmed that global 6G standardization work has become more clearly defined, with 3GPP Release 21 planned as the first 6G specification version and related work continuing…

FPC Bend Area Via Design: Flex PCB Reliability Guide Flexible printed circuits have moved from a niche interconnect choice into the mainstream of consumer electronics design. Foldable phone hinge assemblies, true wireless earbud charging modules, wearable sensors and camera modules all rely on flex circuits because they bend, fold and…

PCB Speaker Amplifier Layout: Laying Out Audio Power Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB speaker amplifier layout from the perspective of a PCBA factory floor,…

Liquid Cooling and PCB Thermal Design in AI Servers Liquid cooling has moved from an optional upgrade to a default assumption in AI data centers during 2026. NVIDIA’s Vera Rubin platform has shifted entirely to liquid cooling, with company documentation stating that the Rubin generation of AI infrastructure operates with…