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IoT Gateway Controller PCBA

Shelf Life Management for Bare PCBs: A Practical Guide

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Shelf Life Management for Bare PCBs: A Practical Guide A bare board is a chemically active object, and its usefulness declines from the moment it is packed. The finish oxidises, the laminate absorbs moisture and the surface accumulates whatever is in the air around it. Shelf life management is the…
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714

Plating Thickness Distribution Across a Panel

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Plating Thickness Distribution Across a Panel Plating thickness is not uniform across a panel, and the variation is a property of the process rather than a defect. The current density is highest where the cathode geometry concentrates it, so the corners of a panel and the isolated features plate differently…
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Automotive PCB Assembly

PCB Handling and Logistics Between Shops

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Handling and Logistics Between Shops A finished board travels from a fabrication shop to an assembly line, and the condition it arrives in decides whether the first process step works. The handling between those two points is part of the product specification, and a change to it is a…
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High-Speed PCB

Solder Joint Microsection Analysis

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Solder Joint Microsection Analysis A microsection is the only way to see inside a solder joint. Visual inspection shows the fillet, X-ray shows the voiding, but neither reveals the intermetallic layer, the grain structure or the crack that has started at the interface between the solder and the pad. When…
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Future Trends in Autonomous Vehicle Control PCBs

Thermal Pad Voiding Control in Power Assembly

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Thermal Pad Voiding Control in Power Assembly A large thermal pad under a power device is a joint with a very small gap and a very large area, and the flux that has to escape from the middle of it has a long way to go. The voids that result…
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GOPCBA Enterprise

Reflow Cooling Rate and Solder Joint Structure

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Reflow Cooling Rate and Solder Joint Structure A solder joint solidifies in a second, and what happens in that second decides the grain structure of the alloy. A fast cooling produces a fine grain and a slow one produces a coarse grain, and the difference shows up in the mechanical…
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SMT-Production-Line

Drill Wear: Design Rules and Process Limits

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Drill Wear: Design Rules and Process Limits Every hole in a board is cut by a tool that is wearing out. A new drill cuts cleanly, a partly worn drill cuts acceptably, and a worn drill tears the copper, roughens the wall and produces a hole that plating cannot fully…
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High Volume PCB Assembly

Fixture Cleaning: Fixture and Tooling Cleaning and Maintenance

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Fixture Cleaning: Fixture and Tooling Cleaning and Maintenance A fixture is a precision tool that is used every day and cleaned rarely. The material that builds up on it changes the height of the board and therefore the print, and the change is gradual enough to go unnoticed. What Builds…
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SMT-Production-Line

Process Audit and Walkthrough in Electronics Assembly

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Process Audit and Walkthrough in Electronics Assembly An audit that only checks whether documents exist tells you very little. An audit that watches the process run and compares it with what the documents say produces findings, and the findings are where the value is. What to Observe The audit should…
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SMT Work Shop

Controlled Impedance: Design Rules and Process Limits

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Controlled Impedance: Design Rules and Process Limits Controlled impedance is a specification that a board must meet, not a property that a stackup automatically provides. The difference between a nominal value and a delivered value comes from the tolerance of every parameter in the stackup: trace width, dielectric thickness, dielectric…
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