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Automation, Robotics, and AI in PCB Assembly

EMC Shields, Gaskets and Frame Grounding

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

EMC Shields, Gaskets and Frame Grounding Where a board has to be shielded, the enclosure, the frame and the gasket form the shield. A gap in the path is the difference between an attenuation figure and a product that fails the radiated emission test. What the Shield Has to Do…

Reverse Polarity Protection Circuit Design

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Reverse Polarity Protection Circuit Design A product that can be connected to its supply the wrong way round needs protection, and the choice of method affects the efficiency, the cost and the behaviour during the fault. The wrong method can protect the circuit and still destroy itself. What Has to…

Electronics Manufacturing with Full Product Traceability

Pin In Paste Reflow For Through Hole Components

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Pin In Paste Reflow For Through Hole Components Through hole components have traditionally been soldered by bringing the board into contact with a wave of molten solder, or by pointing a small wave at the joints in a selective process. Both work, but both require a second thermal excursion after…

Creepage And Clearance Rules For High Voltage PCBs

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Creepage And Clearance Rules For High Voltage PCBs A high voltage board has to keep two conductors apart for two different reasons, and the distances are not the same. The clearance is the shortest distance through the air between two conductors, and it is set by the voltage at which…

Deposit Volume: Solder Paste Deposit Measurement by Weight and Inspection

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Deposit Volume: Solder Paste Deposit Measurement by Weight and Inspection The quantity that decides a solder joint is the volume of paste that was deposited, and the volume is not directly visible. The two ways to measure it are to weigh it and to look at it. Weighing the Deposit…

Solder Joint Strength, Pad Size and Standoff

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Solder Joint Strength, Pad Size and Standoff A solder joint fails when the load on it exceeds what the alloy can carry. The load depends on the assembly, and the strength depends on the volume of solder and on the area it is spread over. Where Strength Comes From The…

LED Assembly Thermal Design and Reflow

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

LED Assembly Thermal Design and Reflow An LED assembly is a thermal design with a light attached. The junction temperature sets the light output, the colour and the life, and the board is the path that removes the heat. Why the Junction Temperature Matters The light output falls as the…

Laminate Selection for Lead Free Reflow Temperatures

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Laminate Selection for Lead Free Reflow Temperatures Lead free reflow runs about thirty degrees higher than the tin lead process it replaced, and the laminate has to survive that. The properties that matter are the glass transition temperature, the decomposition temperature and the expansion below and above the transition. Glass…

Automated X-Ray Inspection For Hidden Solder Joints

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Automated X-Ray Inspection For Hidden Solder Joints Optical inspection can only see what is visible. A ball grid array, a land grid array, a quad flat no lead package, and the underside of a connector all hide their solder joints behind or beneath the package, and the joints that are…

Relay Driver Circuit Design

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Relay Driver Circuit Design A relay driver is a small circuit with a large job, because the coil and the contacts have very different requirements. The coil needs a defined current and a path for the energy it stores, and the contacts have to switch a load whose nature may…

EMC Shields, Gaskets and Frame Grounding

Reverse Polarity Protection Circuit Design

Pin In Paste Reflow For Through Hole Components

Creepage And Clearance Rules For High Voltage PCBs

Deposit Volume: Solder Paste Deposit Measurement by Weight and Inspection

Solder Joint Strength, Pad Size and Standoff

LED Assembly Thermal Design and Reflow

Laminate Selection for Lead Free Reflow Temperatures

Automated X-Ray Inspection For Hidden Solder Joints

Relay Driver Circuit Design

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