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厚铜板

The BOM in PCBA: Bill of Materials Control That Prevents Delays

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
The BOM in PCBA: Bill of Materials Control That Prevents Delays Every assembly quotation starts with the same request, and it is not the Gerber files. The assembler needs a bill of materials, because that single document defines what has to be bought, how the line has to be set…
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224

PCB Level Shielding: Board Shields, Cans and Faraday Cages

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Level Shielding: Board Shields, Cans and Faraday Cages Enclosure shielding is the first line of defence against radiated emissions, and on modern products it is increasingly compromised. Ventilation openings, display windows, cable penetrations and connector cut-outs all break the shield, and the degradation is not gradual: a single large…
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PCB Assembly Cost

High-Speed PCB Via Design: Parasitics and Sizing

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
High-Speed PCB Via Design: Parasitics and Sizing On a fast board, the via is usually the weakest electrical element in the interconnect. It is short, it is cheap, and it is invisible on the schematic, yet it adds capacitance to the trace, inductance to the return path, and a stub…
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BGA-Inspection

PCB ECO Change Control: Changing the Design on Purpose

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB ECO Change Control: Changing the Design on Purpose Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB ECO change control from the perspective of a PCBA factory…
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high-reliability Battery Management System (BMS) PCBAs

HDI PCB Technology and Microvia Design Rules

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
HDI PCB Technology and Microvia Design Rules A high-density interconnect board is not simply a multilayer board with more layers. It is a board whose interconnect is dense enough that ordinary through-hole vias can no longer serve every connection, so the design moves to smaller holes, finer features and vias…
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Home Energy Monitoring Device PCBA

PCB Last Time Buy Decision: Buying Before It Goes

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Last Time Buy Decision: A Practical Manufacturing Guide Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB last time buy decision from the perspective of a PCBA…
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LED PCB Assembly

PCB Component Obsolescence Plan: When the Part Disappears

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Component Obsolescence Plan: Design, Process, and Quality Notes Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB component obsolescence plan from the perspective of a PCBA factory…
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PCB Components

PCB Second Source Qualification: Having a Plan B

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Second Source Qualification: Having a Plan B Modern electronics depend on boards that are assembled correctly the first time. Every product – a phone, a charger, a medical instrument or an industrial controller – relies on thousands of solder joints that must conduct current for years. This article explains…
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Conformal Coating for PCBs

Analog and Digital Ground Separation in Mixed Designs

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Analog and Digital Ground Separation in Mixed Designs Once a design contains an ADC beside a switching clock, the question of how to treat analog and digital ground comes up in every review. The conventional answer is to split the two and tie them at one point, but the split…
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High-Reliability PCB Assembly

PCB Aging Test for A Product: Burning It In

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Aging Test for A Product: Burning It In Modern electronics depend on boards that are assembled correctly the first time. Every product – a phone, a charger, a medical instrument or an industrial controller – relies on thousands of solder joints that must conduct current for years. This article…
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Recent Posts

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Cheap PCB Costs: PCB Design, PCB Manufacturing & SMT vs TH Guide

Cheap PCB Costs: PCB Design, PCB Manufacturing & SMT vs TH Guide

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