Via in Pad Plated Over: Design Rules for Dense BGA Assembly The Problem With an Ordinary Via in a BGA Pad Fine pitch ball grid arrays force a design decision that has no clean answer in conventional fabrication. Routing escapes from a dense BGA often requires vias placed directly in…

PCB Registration Measurement System: Proving the Layers Line Up Modern electronics depend on boards that are assembled correctly the first time. Every product – a phone, a charger, a medical instrument or an industrial controller – relies on thousands of solder joints that must conduct current for years. This article…

PCB Prepreg Volatile Content: What Leaves the Stack Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB prepreg volatile content from the perspective of a PCBA factory floor,…

Blind Via PCB Manufacturing: Stackup, Process and Cost The Interconnect That Makes High Density Possible As products shrink and their silicon becomes denser and faster, the wiring capacity of a conventional multilayer board runs out. Through-holes consume routing area on every layer they pass through, and once a design needs…

PCB Prepreg Gel Time: Practical Process Controls Modern electronics depend on boards that are assembled correctly the first time. Every product – a phone, a charger, a medical instrument or an industrial controller – relies on thousands of solder joints that must conduct current for years. This article explains PCB…

Radar PCB Assembly: RF Materials, Process Control and Cost Where High Frequency Meets High Consequence Radar systems sit at the intersection of microwave engineering, precision signal processing and very high reliability requirements. Whether the application is defence surveillance, automotive ADAS, aerospace or industrial sensing, the platform demands far more from…

PCB Prepreg Resin Content Test: From Design to Repeatable Production Modern electronics depend on boards that are assembled correctly the first time. Every product – a phone, a charger, a medical instrument or an industrial controller – relies on thousands of solder joints that must conduct current for years. This…

Satellite Communication PCBA Cost: Factors, Ranges and Lead Time Cost, Reliability and Schedule in One Decision Satellite communication hardware operates in high vacuum, under sustained radiation, and through repeated thermal cycling. Once in orbit there is effectively no repair or replacement option, so the assembly cost of a satellite communication…

PCB Lamination Pressure Profile: What Buyers and Engineers Should Check Modern electronics depend on boards that are assembled correctly the first time. Every product – a phone, a charger, a medical instrument or an industrial controller – relies on thousands of solder joints that must conduct current for years. This…

PCB Lamination Void at Copper Edge: Design, Process, and Quality Notes Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB lamination void at copper edge from the perspective…