PCB TDR Measurement Problems: Practical Process Controls Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB TDR measurement problems gives you a practical advantage when you…

Underfill Flow Control: Filling the Gap Under a Package Underfill is a filled polymer dispensed along the edge of a package and drawn into the gap beneath it by capillary action, where it cures and couples the package, the solder joints and the board into one structure. Its purpose is…

PCB TDR Measurement Checklist: What to Check Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB TDR measurement checklist from the perspective of a PCBA factory floor, covering…

Component Floor Life: Managing Moisture Sensitivity A plastic package absorbs moisture from the air, and the absorbed water turns to steam when the package is heated to reflow temperature. The pressure that develops can crack the package, delaminate the die attach or lift the bond wires, and much of that…

Squeegee Durometer and Wear: Holding the Print Window The squeegee is the part of the printing process that turns a reservoir of solder paste into a defined deposit, and its condition changes the result before any other variable is touched. A blade that has worn or hardened no longer rolls…

PCB TDR Measurement Selection: Design and Assembly Considerations Modern electronics depend on boards that are assembled correctly the first time. Every product – a phone, a charger, a medical instrument or an industrial controller – relies on thousands of solder joints that must conduct current for years. This article explains…

PCB TDR Measurement Improvement: Design and Assembly Considerations Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB TDR measurement improvement from the perspective of a PCBA factory floor,…

PCB TDR Measurement Traceability: Design and Assembly Considerations Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB TDR measurement traceability gives you a practical advantage when…

Screw Torque Control in PCBA Assembly: Drivers and Checks Screw torque control covers every threaded fastener on an assembled board, from a small bracket screw to a heat sink stud. The torque applied decides whether the joint stays tight in service and whether the board underneath survives the assembly operation.…

PCB Drill Spindle Speed: RPM, Chip Load and Hole Wall PCB drill spindle speed is the rotational rate of the bit, and it sets the cutting speed at the cutting edge. Together with the feed rate it decides how much material each flute removes per revolution. That pairing, called the…