Frank Guo - Kingda - Page 120 Of 591

Reflow Zones: Reflow Zone Tuning for Consistent Joints

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Reflow Zones: Reflow Zone Tuning for Consistent Joints A reflow oven is a series of temperature controlled zones and a belt, and the profile a board experiences is the result of all of them together. Tuning the zones is how a specification on paper becomes a repeatable result on the…

Solder Paste Slump Causes and Control

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Solder Paste Slump Causes and Control Slump is the change in shape of a paste deposit between printing and reflow, and it is measured as the spread of the deposit beyond the aperture footprint. A paste that slumps bridges two pads before the alloy ever melts, and the defect appears…

Vacuum level gauge and seal groove on a drilling chuck

Chip Tombstoning and Paste Print Balance

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Chip Tombstoning and Paste Print Balance Tombstoning is the failure where a two terminal chip component stands on one end after reflow instead of lying flat. It is a visible defect, easily detected, and it is caused by an imbalance in the forces acting on the two terminations during melting.…

Choosing Copper Weight for Power and High Current Boards

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Choosing Copper Weight for Power and High Current Boards Copper weight is one of the first numbers a designer chooses and one of the last to be questioned, yet it drives current capacity, thermal behaviour, etch capability and cost at the same time. Specifying one ounce when the board carries…

Low-Volume PCB Assembly and Prototype Runs

Reflow Oven Flux Condensate and Maintenance

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Reflow Oven Flux Condensate and Maintenance A reflow oven runs for weeks with flux vapour condensing inside it. The residue collects on the chamber walls, the heaters, the conveyor and the cooling section, and it changes the way the oven behaves long before it becomes visible on a board. Oven…

Electroformed Stencil: Electroformed vs Laser Cut Stencils

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Electroformed Stencil: Electroformed vs Laser Cut Stencils A stencil is a consumable tool that sets the deposit on every joint of every board it produces. Two manufacturing routes dominate: laser cutting a stainless foil, and electroforming nickel onto a mandrel so that the aperture grows to its final shape. They…

Selective Coating Robot Path Programming

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Selective Coating Robot Path Programming Selective coating applies material only where it is wanted, using a robot or a gantry to move a dispense valve along a programmed path. It avoids the masking that spraying and dipping require, and it puts the coating exactly on the areas the design identified.…

Alloy Selection for Fine Pitch Solder Paste

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Alloy Selection for Fine Pitch Solder Paste A fine pitch joint holds a very small volume of alloy, and that changes the requirements on the paste. Printability, powder size and flux activity all matter more than they do at a coarse pitch, and the alloy itself has to be chosen…

Solder Preform Application Methods: Design Rules, Flux and Reflow

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Solder Preform Application Methods: Design Rules, Flux and Reflow A solder preform is simply a shaped piece of alloy placed into a joint before heating. In power assemblies, where joints are large, metal is thick and thermal paths are heavy, that simple idea solves problems that paste alone cannot. Preforms…

Loss Tangent: Design Rules and Process Limits

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Loss Tangent: Design Rules and Process Limits Two numbers on a laminate datasheet decide how much a high speed channel loses: the dielectric constant and the loss tangent. The first sets the impedance and the propagation velocity, the second sets how much energy the material absorbs. Choosing a laminate is…

Reflow Zones: Reflow Zone Tuning for Consistent Joints

Solder Paste Slump Causes and Control

Chip Tombstoning and Paste Print Balance

Choosing Copper Weight for Power and High Current Boards

Reflow Oven Flux Condensate and Maintenance

Electroformed Stencil: Electroformed vs Laser Cut Stencils

Selective Coating Robot Path Programming

Alloy Selection for Fine Pitch Solder Paste

Solder Preform Application Methods: Design Rules, Flux and Reflow

Loss Tangent: Design Rules and Process Limits

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