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NTC Thermistor Linearization Circuit Design

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
NTC Thermistor Linearization Circuit Design An NTC thermistor is one of the cheapest and most accurate ways to measure temperature, and its output is one of the least convenient. The resistance falls steeply and non linearly as the temperature rises, so the circuit and the firmware both have to work…
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8-1

Via Filling and Planarization for Stacked Via Designs

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Via Filling and Planarization for Stacked Via Designs An unfilled via is a hole with copper on its walls and nothing in the middle. That is perfectly acceptable on an ordinary board, but it becomes a problem the moment a designer wants to place a pad directly above it, or…
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smart-home-PCBA

Plated Copper Ductility and Elongation Testing Methods

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Plated Copper Ductility and Elongation Testing Methods A plated through hole has to survive the expansion and contraction of the board around it, and that means the copper in the barrel has to stretch without breaking. Ductility is the property that allows it, and it is not the same as…
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60

Thermal Cycling Test Design and Interpretation

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Thermal Cycling Test Design and Interpretation A thermal cycling test is not a single test. The ramp rate, the dwell time, the temperature extremes and the number of cycles each change the mechanism that the test exercises, and a test that does not match the application can pass a design…
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Smart Water Pump Control Box PCBA

Solder Balling: Design Rules and Process Limits

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Solder Balling: Design Rules and Process Limits Solder balls are small spheres of solder left on the board surface beside a joint. They are not part of any connection, and a ball that is large enough or loose enough can bridge two conductors or roll into a sensitive area. The…
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Smart Water Pump Control Box PCBA

Solder Mask Thickness Control for Dense PCB Layouts

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Solder Mask Thickness Control for Dense PCB Layouts Solder mask thickness is not one number. It is a distribution that depends on the copper underneath, the application method, the cure and the geometry of the pattern, and on a dense board that distribution becomes wide. A mask that is thick…
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High-Frequency PCB Design

Wave Solder Pallet Design And Use

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Wave Solder Pallet Design And Use A wave soldering process brings the board into contact with a standing wave of molten solder. For a board that carries surface mount parts on one side and through hole parts on the other, the fixture that carries the board is what makes the…
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55387056_2

Drill Registration and Layer-to-Layer Alignment Control

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Drill Registration and Layer-to-Layer Alignment Control Holes rarely land exactly where the artwork intended them to. Every layer is imaged, etched, laminated and drilled with its own small errors, and the hole must still land inside the pad on every layer it passes through. Registration is the discipline of keeping…
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High-Frequency PCB Design

Load Cell Amplifier Gain Selection

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Load Cell Amplifier Gain Selection A load cell converts a force into a small differential voltage, and the amplifier that follows decides how much of that voltage the system can actually use. Gain selection is not a single number: it depends on the full scale output of the bridge, the…
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op1

PCB Layout: Placement and Routing Practice

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Layout: Placement and Routing Practice PCB layout is where a schematic becomes a piece of hardware, and most of the problems that appear during bring up were decided on the screen rather than in the fabrication shop. Placement sets the shape of every current path on the board, the…
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