HVLP Copper Foil and the Material Bottleneck in AI Server PCBs On August 9, 2026, supply chain information indicated that HVLP, or hyper very low profile, copper foil, a key material for M9 grade high speed copper clad laminate, is facing a pronounced supply-demand gap approaching 50 percent. Processing fees…

PCB Warp Control for 20+ Layer Boards: Five Points That Decide Yield “The prototype was fine, but production warps” is one of the most common complaints from buyers of high layer count PCBs. When board layer count exceeds 20, thickness exceeds 3 mm, or the stackup is asymmetric, warping becomes…

EV Charger PCBA: 600kW Liquid-Cooled Power Module Manufacturing As Chinese charging equipment manufacturers expand into more than 90 countries and regions, the PCBA inside a 600 kW liquid-cooled ultra-fast charger power module has become a decisive factor in whether a product passes overseas certification and whether it runs reliably for…

SMT Solder Paste Printing When Tall Components Block the Squeegee On August 21 and 22, 2026, a patent covering an irregular PCB printing machine and printing method was published, addressing solder paste printing on boards that have raised structures on their top surface. The approach uses vision recognition combined with…

AI Server PCBA: Quality Control With 440,000 MLCCs Per Rack In August 2026, MLCC supply for AI servers entered its strongest price cycle in nearly a decade. Samsung Electro-Mechanics raised MLCC prices by approximately 30 percent from August 1, with some high capacitance MLCCs for AI servers rising 60 to…

High Frequency FCCL: Where Flex PCB Materials Are Heading Through August 2026, progress in domestic high frequency, high speed, low dielectric loss flexible copper clad laminate attracted renewed market attention. Company reports and recent research disclosures describe a composite technology combining fluorine-modified polyimide with expanded PTFE, used with an adhesive-free…

Logistics Robot PCB and PCBA at Million-Unit Scale On September 9, 2026, the JD Global Technology Explorer Conference was held in Beijing, where JD Logistics presented its Super Brain and Wolf Pack robot product portfolio for the first time and announced plans to procure 3 million robots, 1 million unmanned…

6G RF PCB Design: Sub-THz Constraints Reach Phone Programs Early On September 4, 2026, industry reporting indicated that European CE-RED requirements are extending radio frequency compatibility validation for high end AI smartphones further into the 6G sub-terahertz bands, and are bringing RF front end modules, full-device coexistence testing and certification…

ABF Substrate Price Increase and the Material Bottleneck Behind AI On September 8, 2026, market reporting drew attention back to ABF material upstream of IC substrates. Ajinomoto produces ABF, the key interlayer insulating material used in high performance semiconductor package substrates, and company information indicates its global market share exceeds…

PTFE PCB Material and the AI Backplane Material Race Through August 2026, a shift in the material roadmap for NVIDIA’s Rubin Ultra orthogonal backplane became a focus of supply chain attention. Information from multiple research institutions and industry sources indicates that the backplane program is evaluating and advancing PTFE-based material…