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Rigid-Flex PCB

Medical Wearable PCB: Why Smartwatch Precision Keeps Rising | gopcb

  • By Frank guo
  • 2026年 9月 12日
  • PCB Assembly
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Medical Wearable PCB: Why Smartwatch Precision Keeps Rising The US FDA cleared Apple’s Hypertension Notification Feature through the 510(k) pathway for Apple Watch Series 9 and later and Apple Watch Ultra 2 and later. The feature does not measure blood pressure directly. It uses data collected by the optical heart…
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SMT Assembly

AI Glasses FPC and Micro HDI: Manufacturing at Ten Million Units | gopcb

  • By Frank guo
  • 2026年 9月 12日
  • PCB Assembly
  • No Comments
AI Glasses FPC and Micro HDI: Manufacturing at Ten Million Units Through September 2026, the AI glasses industry has visibly accelerated in both capitalization and scale. Industry information indicates that more than 65 new AI glasses products were launched globally in the first half of the year, XREAL has advanced…
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PCB Manufacturing

Foldable Phone FPC: From Static Connector to Dynamic Component | gopcb

  • By Frank guo
  • 2026年 9月 12日
  • PCB Assembly
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Foldable Phone FPC: From Static Connector to Dynamic Component On the morning of September 10, 2026 Beijing time, Apple officially released its first foldable phone, the iPhone Duo. The device uses a book-style fold with a 7.6 inch inner display when opened and a 5.4 inch outer display when closed,…
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PCB Pad Design

mSAP Optical Module PCB: The 1.6T Bottleneck Nobody Plans For | gopcb

  • By Frank guo
  • 2026年 9月 12日
  • PCB Assembly
  • No Comments
mSAP Optical Module PCB: The 1.6T Bottleneck Nobody Plans For Through September 2026, demand for 800G and 1.6T optical modules has continued to intensify, and PCB manufacturers have begun accelerating mSAP capacity expansion in response. One major supplier has been building optical module mSAP lines simultaneously in three locations, with…
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Deposit adhesion tested on a brush plated repair area

AI Server PCB Supply: Why Effective Capacity Matters More Than Labels | gopcb

  • By Frank guo
  • 2026年 9月 12日
  • PCB Assembly
  • No Comments
AI Server PCB Supply: Why Effective Capacity Matters More Than Labels On September 9, 2026, analysts Ben Bajarin and Jay Goldberg debated the AI compute supply chain on the semiconductor podcast The Circuit. Bajarin argued that 2027 may be the year when supply constraints are most visible, with new capacity…
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Filtration loop removing manganese dioxide from a desmear bath

AI and Energy Storage Competing for PCB Capacity: What It Means | gopcb

  • By Frank guo
  • 2026年 9月 12日
  • PCB Assembly
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AI and Energy Storage Competing for PCB Capacity: What It Means On August 18, 2026, Energy Talk reported that continued expansion of AI computing infrastructure is affecting upstream electronic component supply for the energy storage industry. Lead times for some energy storage chips have extended from approximately four weeks to…
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Placement offset before and after self alignment on a reflowed PCB

Thick Copper PCB Demand Rises as Power Semiconductor Capacity Expands | gopcb

  • By Frank guo
  • 2026年 9月 12日
  • PCB Assembly
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Thick Copper PCB Demand Rises as Power Semiconductor Capacity Expands On September 1, 2026, Hua Hong Semiconductor announced that the company and its wholly owned subsidiary Shanghai Hua Hong would join Wuxi Xihong Guoxin Phase II, Huaxin Dingxin and the State Development Corporation in a capital increase for Wuxi Hua…
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high Tg PCB

Why FPC Right Angle Traces Fail: Signal, Etch and Bend Effects | gopcb

  • By Frank guo
  • 2026年 9月 12日
  • PCB Assembly
  • No Comments
Why FPC Right Angle Traces Fail: Signal, Etch and Bend Effects In flex circuit design, trace geometry is one of the factors that most directly determines final product performance. Right angle routing is simple to draw and looks orderly on screen, yet professional design standards treat it as something to…
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Polyimide PCB

HDI Laser Microvia Size Requirements: Diameter, Aspect Ratio and Wall Quality | gopcb

  • By Frank guo
  • 2026年 9月 12日
  • PCB Assembly
  • No Comments
HDI Laser Microvia Size Requirements: Diameter, Aspect Ratio and Wall Quality Laser microvia technology is the enabling process behind high density interconnect boards. By focusing laser energy to drill features at the micron scale, it overcomes the precision limits of mechanical drilling and supports hole diameters from 0.05 mm to…
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Placement offset before and after self alignment on a reflowed PCB

CoWoS-L Ramp and the mSAP PCB Manufacturing Shift | gopcb

  • By Frank guo
  • 2026年 9月 12日
  • PCB Assembly
  • No Comments
CoWoS-L Ramp and the mSAP PCB Manufacturing Shift On August 28, 2026, equipment supplier Chipmore Microelectronics disclosed details from a recent institutional research session. PCB business revenue reached 880 million RMB in the first half of 2026, representing approximately 79.6 percent of total revenue with a PCB gross margin of…
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