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PCB Via Tenting Decision: Covering the Holes

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Via Tenting Decision: Covering the Holes Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB via tenting decision gives you a practical advantage when you…
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PCB Liquid Photoimageable Solder Mask: Coating and Exposing the Mask

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Liquid Photoimageable Solder Mask: Coating and Exposing the Mask Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB liquid photoimageable solder mask gives you a…
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PCB Legend Print Over Coating: The Marking on Top

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Legend Print Over Coating: The Marking on Top Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB legend print over coating from the perspective of a PCBA…
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Reference Designators on a PCB: Prefix Letters and Numbering Rules

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Reference Designators on a PCB: Prefix Letters and Numbering Rules Every component on a board carries a short code printed next to it, and that code is the language the assembly line, the test engineer, and the repair technician all rely on. A reference designator is the combination of a…
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Dental Chair PCBA

PCBA Soldering Requirements: Board Size, Fiducials, and Flatness

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCBA Soldering Requirements: Board Size, Fiducials, and Flatness A board can be electrically flawless and still be rejected by the assembly house, because the soldering process imposes its own requirements on the physical design. Panel dimensions, edge conditions, flatness, fiducials, and pad geometry all have to be compatible with the…
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IC Substitution: Rules for a Safe Second Source

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
IC Substitution: Rules for a Safe Second Source Component shortages have made second sourcing a normal part of hardware development rather than an exception. When the specified device is unavailable, the question becomes whether a similar part from another manufacturer can be used without changing the board. IC substitution is…
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PCB Photo Tool Artwork Film: The Master Image

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Photo Tool Artwork Film: The Master Image Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB photo tool artwork film from the perspective of a PCBA factory…
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Energy-PCBA

PCB Dry Film Resist Lamination: Sticking the Film Down

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Dry Film Resist Lamination: Sticking the Film Down Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB dry film resist lamination gives you a practical…
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Laser Processing in PCB Manufacturing: Cutting, Drilling, Depaneling

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Laser Processing in PCB Manufacturing: Cutting, Drilling, Depaneling Laser processing entered PCB manufacturing as a way to solve problems that mechanical tools handle poorly: very small holes, shapes that a router cannot follow, and panels that cannot tolerate mechanical stress. It is now used across drilling, cutting, depaneling and direct…
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Smart Home

SDRAM Radiation: Layout Rules for External Memory

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
SDRAM Radiation: Layout Rules for External Memory External memory is one of the most common sources of radiated emissions on a microcontroller board, and it is one of the most fixable. A parallel SDRAM bus runs at a high clock rate with fast edges, and its traces carry the same…
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