PCB Microstrip Bend and Stub Effect: Small Features, Big Effect Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB microstrip bend and stub effect from the perspective of…

PCB 50 Ohm Line Design: The Standard Line Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB 50 ohm line design from the perspective of a PCBA factory…

PCB RF Grounding and Via Fences: Keeping the Field In Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB RF grounding and via fences gives you…

PCB on Board Antenna Design: The Board as a Radiator Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB on board antenna design from the perspective of a…

PCB De Embedding of A Test Fixture: Removing the Probe Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB de embedding of a test fixture gives…

PCB S Parameter Measurement of A Channel: Characterising the Board Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB S parameter measurement of a channel gives…

PCB Crosstalk Measurement with TDR: Seeing the Coupling Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB crosstalk measurement with TDR gives you a practical advantage…

PCB Link Budget for A Channel: Adding Up the Losses Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB link budget for a channel from the perspective of…

PCB Serdes Equalisation and the Board: What the Silicon Must Fix Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB serdes equalisation and the board gives…

PCB Glass Weave Effect on Skew: The Pattern Inside the Laminate Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB glass weave effect on skew from the perspective…