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Low-Volume PCB Assembly and Prototype Runs

Reflow Oven Flux Condensate and Maintenance

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Reflow Oven Flux Condensate and Maintenance A reflow oven runs for weeks with flux vapour condensing inside it. The residue collects on the chamber walls, the heaters, the conveyor and the cooling section, and it changes the way the oven behaves long before it becomes visible on a board. Oven…

Electroformed Stencil: Electroformed vs Laser Cut Stencils

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Electroformed Stencil: Electroformed vs Laser Cut Stencils A stencil is a consumable tool that sets the deposit on every joint of every board it produces. Two manufacturing routes dominate: laser cutting a stainless foil, and electroforming nickel onto a mandrel so that the aperture grows to its final shape. They…

Selective Coating Robot Path Programming

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Selective Coating Robot Path Programming Selective coating applies material only where it is wanted, using a robot or a gantry to move a dispense valve along a programmed path. It avoids the masking that spraying and dipping require, and it puts the coating exactly on the areas the design identified.…

Alloy Selection for Fine Pitch Solder Paste

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Alloy Selection for Fine Pitch Solder Paste A fine pitch joint holds a very small volume of alloy, and that changes the requirements on the paste. Printability, powder size and flux activity all matter more than they do at a coarse pitch, and the alloy itself has to be chosen…

Solder Preform Application Methods: Design Rules, Flux and Reflow

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Solder Preform Application Methods: Design Rules, Flux and Reflow A solder preform is simply a shaped piece of alloy placed into a joint before heating. In power assemblies, where joints are large, metal is thick and thermal paths are heavy, that simple idea solves problems that paste alone cannot. Preforms…

PCB Placement Nozzle Sample: Checking a Small Piece

By 杰夫
2026年 9月 13日
PCB Assembly
No Comments

PCB Placement Nozzle Sample: Checking a Small Piece Modern electronics depend on boards that are assembled correctly the first time. Every product – a phone, a charger, a medical instrument or an industrial controller – relies on thousands of solder joints that must conduct current for years. This article explains…

Loss Tangent: Design Rules and Process Limits

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Loss Tangent: Design Rules and Process Limits Two numbers on a laminate datasheet decide how much a high speed channel loses: the dielectric constant and the loss tangent. The first sets the impedance and the propagation velocity, the second sets how much energy the material absorbs. Choosing a laminate is…

Dispensing Nozzle Choices for Paste Jetting

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Dispensing Nozzle Choices for Paste Jetting Solder paste jetting applies paste without a stencil, using a valve to fire small deposits onto the pads as the board moves underneath. It exists because some products cannot be printed: boards with severe height variation, assemblies where a stencil cannot be supported, small…

PCB Placement Nozzle Maintenance: Keeping It Working

By 杰夫
2026年 9月 13日
PCB Assembly
No Comments

PCB Placement Nozzle Maintenance: Keeping It Working Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB placement nozzle maintenance gives you a practical advantage when you…

PCB Placement Nozzle Timing: How Long It Takes

By 杰夫
2026年 9月 13日
PCB Assembly
No Comments

PCB Placement Nozzle Timing: How Long It Takes Modern electronics depend on boards that are assembled correctly the first time. Every product – a phone, a charger, a medical instrument or an industrial controller – relies on thousands of solder joints that must conduct current for years. This article explains…

Reflow Oven Flux Condensate and Maintenance

Electroformed Stencil: Electroformed vs Laser Cut Stencils

Selective Coating Robot Path Programming

Alloy Selection for Fine Pitch Solder Paste

Solder Preform Application Methods: Design Rules, Flux and Reflow

PCB Placement Nozzle Sample: Checking a Small Piece

Loss Tangent: Design Rules and Process Limits

Dispensing Nozzle Choices for Paste Jetting

PCB Placement Nozzle Maintenance: Keeping It Working

PCB Placement Nozzle Timing: How Long It Takes

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