Press-Fit Connector Hole Design and Retention A compliant press-fit pin carries its own spring. It is inserted into a plated through hole that is slightly smaller than the pin, and the pin deforms elastically so that it presses against the barrel over the whole depth of the hole. The termination…

Panel Carrier and Fixture Design A carrier or fixture holds a board or a panel through a process step, and its design decides whether the assembly is supported, aligned and protected. On a product with an unusual shape or a thin board it is the difference between a process that…

Cold Solder Joints: Causes and Detection A cold solder joint looks like a solder joint and behaves like a resistor. It forms when the alloy solidifies without having reached a proper wetting temperature, so the metal never bonds metallurgically to the pad and the lead. The joint passes a quick…

Stencil Design for Mixed Technology Boards A mixed technology board carries both surface mount and through hole parts, and the stencil has to serve both in one print or in two. The design of the foil therefore has to accommodate apertures for fine pitch devices alongside large pads for connectors…

Solder Mask Cure Profile: Process and Verification The solder mask cure profile is the thermal cycle that turns a printed liquid film into a hard, chemically resistant coating. It is the step that decides whether the mask will survive the assembly soldering process, resist the flux chemistry, and hold its…

Step Stencil Design for Paste Volume Control A single stencil thickness is a compromise. The paste volume a joint needs depends on the pad area, the component pitch and the thermal mass behind it, and those requirements pull in opposite directions across a mixed board. A step stencil resolves the…

Wire and Cable Soldering Practice A wire or a cable is soldered because the joint has to survive movement, and that requirement changes everything about the technique. The strand, the insulation and the strain relief all matter more than the appearance of the joint. The failure modes are also different…

Board Level Reliability Test Plan and Sample Size A reliability test answers a specific question, and the question has to be written before the test is chosen. A plan that lists tests without stating what each one decides produces data that cannot be used to make a decision. Starting From…

Thermal Interface Material Application A thermal interface material fills the microscopic gap between two surfaces so that heat can cross it, and its performance depends on the thickness of that layer as much as on its conductivity. A material with a high conductivity applied too thickly performs worse than a…

Production Line Uptime and OEE OEE combines availability, performance and quality into a single figure, and its value is that it makes the three losses visible separately. A line that reports a single number without the components cannot be improved deliberately. The measure is often used as a target, which…