UV Laser Depaneling For Assemblies Laser depaneling separates boards from their panel with a focused beam instead of a router bit. It applies no mechanical force to the assembly, it can follow any outline including a curve or an internal cut-out, and it leaves no dust in the sense of…

PCB SPI Data: What the Numbers Say Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB SPI data gives you a practical advantage when you choose…

Dielectric Constant Measurement Methods for Laminates The dielectric constant of a laminate determines how fast a signal travels in a trace and how wide the trace has to be to present a given impedance. It is the number a designer uses most often when a controlled impedance stack is designed,…

PCB SPI Plan: Laying It Out First Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB SPI plan gives you a practical advantage when you choose…

PCB SPI Limits: Where the Edges Are Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB SPI limits gives you a practical advantage when you choose…

PCB SPI Setup: Getting Ready Modern electronics depend on boards that are assembled correctly the first time. Every product – a phone, a charger, a medical instrument or an industrial controller – relies on thousands of solder joints that must conduct current for years. This article explains PCB SPI setup…

Via Tenting: Design Rules and Process Limits Solder mask over a via can be applied in two quite different ways. Tenting covers the via completely, with the mask bridging across the drilled hole and sealing it. Plugging fills the hole with mask ink or with a dedicated plugging material, leaving…

CTE Measurement Methods for PCB Laminate Selection Copper expands about five times as much as the laminate around it, so a plated hole in a printed circuit board is under stress every time the board changes temperature. The coefficient of thermal expansion describes how much a material grows for each…

PCB SPI Maintenance: Keeping It Working Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB SPI maintenance from the perspective of a PCBA factory floor, covering maintaining SPI…

PCB SPI Standards: Agreeing the Rules Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB SPI standards gives you a practical advantage when you choose a…