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Deposit adhesion tested on a brush plated repair area

Solder Paste: Design Rules and Process Limits

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Solder Paste: Design Rules and Process Limits Solder paste is a mixture of metal powder and flux, and both halves of that mixture have to be chosen for the board rather than picked from a catalogue. The alloy sets the temperature at which the joint forms and the mechanical behaviour…

Ionic Contamination Testing On Assembled Boards

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Ionic Contamination Testing On Assembled Boards Cleanliness is invisible, so it has to be measured rather than judged by appearance. A board with a heavy rosin residue may be perfectly clean in the electrical sense, while one that looks spotless may carry enough ionic material at a connector to promote…

PCB Coupon Design Guide

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

PCB Coupon Design Guide A pcb coupon is a structure that is built onto the production panel but is not part of the product. It exists so that something can be measured, cut, or cycled without destroying a board. A panel without a coupon is a panel whose process can…

Cleaning After Assembly And Residue Removal

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Cleaning After Assembly And Residue Removal Whether a board should be cleaned after assembly is a decision that follows from the flux, the product and the environment rather than from a habit. A no clean flux leaves a residue that is designed to be harmless, and cleaning it can be…

Solder Ball Design Guide

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Solder Ball Design Guide A solder ball is a sphere of alloy attached to the underside of a ball grid array package, and it becomes the joint when the package is reflowed onto the board. The ball is supplied with the package, so the designer usually chooses the board and…

Selective Soldering: Key Checks Before Release

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Selective Soldering: Key Checks Before Release Selective soldering applies molten solder to individual through hole joints on a board that also carries surface mount parts. It replaces hand soldering where the volume justifies a machine and where the process has to be repeatable, and it is used wherever a printed…

Microsection Analysis Guide

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Microsection Analysis Guide A microsection analysis is the process of cutting a coupon out of a board, potting it, grinding and polishing it, and looking at the result under a microscope. It is the only method that shows what is inside a plated hole and between the layers, and it…

Press Fit Pin Hole Tolerance And Plating

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Press Fit Pin Hole Tolerance And Plating A press fit connector is held in the board by friction alone. The pin is larger than the hole by a controlled amount, the pin deforms elastically as it enters, and the resulting contact pressure makes the electrical connection. There is no solder,…

Reflow Void Reduction Guide

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Reflow Void Reduction Guide A reflow void is a bubble of gas trapped inside a solder joint. It is invisible from the outside, it reduces the area that carries the current and the heat, and it is measured by X ray rather than by the eye. The gas comes from…

Stencil Aperture: Design Rules and Process Limits

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Stencil Aperture: Design Rules and Process Limits A stencil aperture is the opening through which the solder paste is printed onto a pad. It is a few tenths of a millimetre across, and it decides the volume of solder that will form the joint. The pad is the electrical feature…

Solder Paste: Design Rules and Process Limits

Ionic Contamination Testing On Assembled Boards

PCB Coupon Design Guide

Cleaning After Assembly And Residue Removal

Solder Ball Design Guide

Selective Soldering: Key Checks Before Release

Microsection Analysis Guide

Press Fit Pin Hole Tolerance And Plating

Reflow Void Reduction Guide

Stencil Aperture: Design Rules and Process Limits

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