Blog

V2X Module Board Design for Vehicle Communication

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

V2X Module Board Design for Vehicle Communication A module that lets a vehicle talk to other vehicles and to the road infrastructure is a radio product in a harsh environment. V2X module board design combines radio frequency layout with the electrical and thermal requirements of automotive electronics. What V2X Communication…

Drop Testing and Shock Resistance for Electronic Assemblies

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Drop Testing and Shock Resistance for Electronic Assemblies Dropping a product is one of the most severe mechanical events it can experience, and it happens in a fraction of a second. The acceleration involved can exceed a thousand times gravity, and the whole event is over before any protection circuit…

PID Temperature Controller Circuit Design

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

PID Temperature Controller Circuit Design A temperature controller compares a measurement with a set point and adjusts the power delivered to a heater. The electronics are straightforward; the difficulty is that heat moves slowly, and a loop that is tuned for a fast response will oscillate in a way that…

Humidity, Condensation and Moisture Protection of Assemblies

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Humidity, Condensation and Moisture Protection of Assemblies Moisture reaches an assembly in two ways: as vapour that condenses on a cold surface, and as liquid that enters through a vent or a seal. Both produce the same result, and the design decides which one happens. How Condensation Forms Air holds…

PCB Solder Paste Risks: What Could Go Wrong

By 杰夫
2026年 9月 13日
PCB Assembly
No Comments

PCB Solder Paste Risks: What Could Go Wrong Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB solder paste risks gives you a practical advantage when…

Solder Paste Rheology and the Print Window

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Solder Paste Rheology and the Print Window Paste is a thixotropic fluid: it flows when it is sheared and it recovers when the shear stops. The print window is the range of conditions over which that behaviour gives a good deposit. What Thixotropy Means Here When the squeegee rolls the…

Rework Heating Methods and Local Thermal Stress

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Rework Heating Methods and Local Thermal Stress Rework is a localised reflow performed on an assembly that is already populated. The heat has to reach one joint without moving the joints beside it, and the methods differ mainly in how well they do that. The Problem With Local Heat Heat…

Avalanche Photodiode Bias Design

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Avalanche Photodiode Bias Design An avalanche photodiode multiplies the photocurrent internally by operating close to its breakdown voltage, which gives it a sensitivity that a plain photodiode cannot match. The multiplication factor changes steeply with the bias, so the supply and its stability are the whole design. How the Multiplication…

PCB Labeling And Traceability Requirements

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

PCB Labeling And Traceability Requirements A finished board carries more than copper and solder mask. It carries a date code, a part number, a revision, a flammability marking, and increasingly a two dimensional code that links it to a production record. That information is what makes a board traceable, and…

PCB Solder Paste Sample: Checking a Small Piece

By 杰夫
2026年 9月 13日
PCB Assembly
No Comments

PCB Solder Paste Sample: Checking a Small Piece Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB solder paste sample from the perspective of a PCBA factory floor,…

V2X Module Board Design for Vehicle Communication

Drop Testing and Shock Resistance for Electronic Assemblies

PID Temperature Controller Circuit Design

Humidity, Condensation and Moisture Protection of Assemblies

PCB Solder Paste Risks: What Could Go Wrong

Solder Paste Rheology and the Print Window

Rework Heating Methods and Local Thermal Stress

Avalanche Photodiode Bias Design

PCB Labeling And Traceability Requirements

PCB Solder Paste Sample: Checking a Small Piece

PCB ASSEMBLY

OUR SERVICES

TECHNICAL SUPPORT

ABOUT US

LOCATIONS

New York Office

FOLLOW US