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IoT Gateway Controller PCBA

PCB Card Edge Connector Layout: Fingers for a Slot

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Card Edge Connector Layout: Fingers for a Slot Modern electronics depend on boards that are assembled correctly the first time. Every product – a phone, a charger, a medical instrument or an industrial controller – relies on thousands of solder joints that must conduct current for years. This article…
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project image

Aluminium Base PCB: Substrate, Dielectric and Copper Foil

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Aluminium Base PCB: Substrate, Dielectric and Copper Foil An aluminium base PCB is a sandwich of three materials with very different properties, and its performance is decided by the thinnest layer in the stack. The metal core provides stiffness and heat spreading, the copper carries the circuit, and the dielectric…
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4

BT Resin versus ABF Substrate: Material Comparison

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
BT Resin versus ABF Substrate: Material Comparison Two material systems dominate the package substrate industry, and they are used together as often as they are compared. One is a rigid laminate used as the core of the substrate, and the other is a film laminated onto that core to build…
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Rigid-Flex PCB

Legend Printing and Solder Mask: How the Process Shapes Design Rules

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Legend Printing and Solder Mask: How the Process Shapes Design Rules Solder mask and legend are the two printed layers that most designers treat as decoration, and both of them are process steps with real constraints. The mask has to survive the soldering process and protect the copper; the legend…
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55387056_21_1

Application Processor Board Design: Interfaces and Layout Demands

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Application Processor Board Design: Interfaces and Layout Demands An application processor is a system on a chip that expects to be surrounded by memory, storage, display, camera and network interfaces, and a board designed around one is judged by how well it delivers those interfaces rather than by the processor…
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Smart Healthcare

Embedded Copper Coin PCB: Structure, Process and Design

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Embedded Copper Coin PCB: Structure, Process and Design A copper coin is a solid piece of copper pressed into a cavity in a circuit board so that it passes through the thickness of the laminate beneath a hot component. It carries heat from the surface of the board to the…
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Engineering Review & DFM Analysis

Stepped Board Fabrication: Cavity and Lamination Process

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Stepped Board Fabrication: Cavity and Lamination Process A stepped board is one whose surface is not flat. Part of the board is recessed, so that a component sits below the general surface level, or a cavity is opened so that a die, a sensor or an optical element can be…
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HDI PCB Design Guide

PCB Prototyping: Quality, Lead Time and Price

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Prototyping: Quality, Lead Time and Price A prototype is a test of a design, so the useful question about a prototype supplier is not which one is cheapest but which one gives the fastest feedback. Quality, lead time, price, and process capability are the four variables, and they trade…
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How to Judge PCB Quality Before Assembly

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
How to Judge PCB Quality Before Assembly A finished board can look perfect and still fail in assembly. The defects that matter are usually not visible at the surface: a thin plating, an oxidized pad, a laminate that absorbs moisture, or a joint that holds until the first thermal cycle.…
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PCB Prototyping

Immersion Tin Surface Finish: Chemistry and Process Control

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Immersion Tin Surface Finish: Chemistry and Process Control As lead-free soldering spread through the industry, and as high reliability products such as automotive electronics became the dominant users, immersion tin moved from a niche finish to a routine one. Its appeal is straightforward: a thin, flat, solderable layer that suits…
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