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BO7B6934

Buried Via, Blind Via and Through Via: Choosing PCB Via Types

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Buried Via, Blind Via and Through Via: Choosing PCB Via Types Every via makes a hole in a board, but not every hole is made the same way or costs the same amount. A through via passes from the top face to the bottom and is drilled after lamination, while…
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Microsection of a multilayer board under a microscope

PCB Glob Top Encapsulation: A Drop Over the Die

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Glob Top Encapsulation: A Drop Over the Die Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB glob top encapsulation gives you a practical advantage…
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medical ventilator PCB assembly

PCB Dam and Fill Encapsulation: A Wall Then a Pool

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Dam and Fill Encapsulation: A Wall Then a Pool Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB dam and fill encapsulation from the perspective of a…
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Automotive-PCB-Assembly

PCB Underfill Application: Filling Under the Part

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Underfill Application: Filling Under the Part Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB underfill application gives you a practical advantage when you choose…
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HMI & Embedded Controller PCBA

PCB Ultrasonic Welding of Joints: Joining With Vibration

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Ultrasonic Welding of Joints: Joining With Vibration Modern electronics depend on boards that are assembled correctly the first time. Every product – a phone, a charger, a medical instrument or an industrial controller – relies on thousands of solder joints that must conduct current for years. This article explains…
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Telecommunications-Electronics

PCB Chip on Board Process: Placing the Die Directly

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Chip on Board Process: Placing the Die Directly Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB chip on board process from the perspective of a PCBA…
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Electronic Components for PCB Design

PCB Gold Plating Types: ENIG, Hard Gold and Thickness

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Gold Plating Types: ENIG, Hard Gold and Thickness Gold appears on a printed circuit board for two reasons, and they rarely coexist. One is chemistry: a thin, dense gold layer over nickel keeps copper from oxidising and preserves a solderable or wire bondable surface for months. The other is…
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Smart Electricity Meter PCBA

PCB Cable Assembly: Crimp, Strain Relief and Routing Practice

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Cable Assembly: Crimp, Strain Relief and Routing Practice Most products do not end at the edge of the board. A PCB cable assembly joins the circuit to the outside world, and it usually carries the signals that are least forgiving: the power feed, the differential pair that runs to…
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High-Speed PCB Materials

Laser Sensor PCB Design for LiDAR and Precision Measurement

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Laser Sensor PCB Design for LiDAR and Precision Measurement A laser sensor measures distance, speed or presence by emitting light and detecting what returns. The electronics that make that measurement have to resolve a pulse that may be a few nanoseconds wide and a few photons strong, and they have…
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Smart Home WiFi Control-Module-PCBA

High Temperature PCB Manufacturing: Materials and Process

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
High Temperature PCB Manufacturing: Materials and Process Building a board that has to work at 200 degrees Celsius is not simply a matter of buying a better laminate. It changes the lamination cycle, the drilling parameters, the plating chemistry, the solder mask, the surface finish and the amount of testing…
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