Frank Guo - Kingda - Page 299 Of 591

Make-up water quality check at a plating tank

Fabrication Data Review Before Release

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Fabrication Data Review Before Release Most problems found during fabrication originate in the front end, in the data and the instructions rather than in the process, and the cost of correcting them is paid in schedule. A short review before the data is released removes most of them. Data Completeness…

Loop Area: High Speed Signal Integrity: What the Layout Decides

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Loop Area: High Speed Signal Integrity: What the Layout Decides The signals that cause the most trouble on a board are rarely the fastest ones. They are the ones with the worst return path, the largest loop area or the least margin, and those properties are decided by the layout…

Derating: Component Selection Beyond the Datasheet

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Derating: Component Selection Beyond the Datasheet Selecting a component is a design decision that continues past the datasheet, because the part has to be placed, soldered, inspected and purchased. Each of those adds a constraint that the electrical specification does not capture. Package and Footprint The package determines the footprint,…

Plated Through Hole Soldering: Wave, Selective and Reflow

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Plated Through Hole Soldering: Wave, Selective and Reflow Through hole parts never disappeared. Connectors, transformers, relays and power devices are still mounted through the board, because a plated through hole gives mechanical strength and a solder joint that can be inspected from both sides. The challenge is that wave soldering,…

PCB Failure Analysis: Working From the Mechanism

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

PCB Failure Analysis: Working From the Mechanism Boards fail in the field for a small number of reasons, and most of them are present in the design long before the failure occurs. A failure analysis that begins with the mechanism rather than with the component reaches the cause faster. Start…

Why Metal Core Thermal Conductivity Measurements Differ

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Why Metal Core Thermal Conductivity Measurements Differ Two suppliers quote the same dielectric thermal conductivity for their metal core laminates and the finished boards perform differently. The discrepancy is not necessarily dishonesty; it is usually a difference in what was measured and how. Thermal conductivity of a thin bonded layer…

AQL Sampling Plans for PCB and PCBA Acceptance Checks

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

AQL Sampling Plans for PCB and PCBA Acceptance Checks No fabrication shop inspects every feature of every board, and no customer expects it. Instead, both sides agree on how many units to examine, what to look for, and how many defects are too many. That agreement is a sampling plan,…

Depanelisation Methods and Breakaway Tab Design

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Depanelisation Methods and Breakaway Tab Design A board that has to be depaneled is at its most vulnerable during the separation, because the force applied to break a tab is transmitted into the material around it. Designing the depanelisation step is therefore part of designing the board. Routing, Scoring and…

Rigid-Flex PCB Design: Stack-Up, Materials and Transition Zones

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Rigid-Flex PCB Design: Stack-Up, Materials and Transition Zones When a product needs a board-to-board connection that survives repeated movement, the choice is usually between a cable assembly, a flex circuit with connectors at both ends, and a rigid-flex board where the flexible layers are part of the same laminated stack…

PCB Repair Techniques: Pads, Traces and Components

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

PCB Repair Techniques: Pads, Traces and Components PCB repair is the discipline of returning a board to service without making it worse. That sounds modest, and it is the whole difficulty: the operation that replaces a failed component can lift a pad, damage a neighbouring part or leave a joint…

Fabrication Data Review Before Release

Loop Area: High Speed Signal Integrity: What the Layout Decides

Derating: Component Selection Beyond the Datasheet

Plated Through Hole Soldering: Wave, Selective and Reflow

PCB Failure Analysis: Working From the Mechanism

Why Metal Core Thermal Conductivity Measurements Differ

AQL Sampling Plans for PCB and PCBA Acceptance Checks

Depanelisation Methods and Breakaway Tab Design

Rigid-Flex PCB Design: Stack-Up, Materials and Transition Zones

PCB Repair Techniques: Pads, Traces and Components

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