WMCM Packaging and the Shift to Substrate-Level Mainboards On August 20, 2026, NDTV Profit cited supply chain information indicating that an image purporting to show an iPhone 18 Pro mainboard points to a new package architecture for the A20 Pro chip, with a noticeably larger neural processing area than the…

Humanoid Robot PCB: Joint Electronics and Power Integration On August 28, 2026, Zhongjian Technology announced that the company and its controlling subsidiary Shanghai Huazhijian had signed an intelligent robot industrialization project investment agreement with the Yongkang Municipal People’s Government. The plan establishes a project implementation entity locally and builds an…

Ultra-Low-Power Medical Sensor PCBA for Multi-Parameter Wearables On September 3, 2026, the digital health industry continued to follow the FDA authorization of Abbott Libre Duo 10 Day. The FDA granted authorization on August 25 through the De Novo pathway for a continuous glucose and ketone monitoring system indicated for people…

Copper Inlay and Copper Pillar PCB Thermal Design for AI Chips Thermal data published in the PCB industry during August 2026 highlighted a problem that has been building for several years. As AI chip power consumption and power density continue to rise, localized peak heat flux has moved beyond 100…

6G Base Station PCB: Backplane Limits With 2048 Antenna Elements On August 18, 2026, industry information from the TD Industry Alliance and related sources confirmed that global 6G standardization work has become more clearly defined, with 3GPP Release 21 planned as the first 6G specification version and related work continuing…

FPC Bend Area Via Design: Flex PCB Reliability Guide Flexible printed circuits have moved from a niche interconnect choice into the mainstream of consumer electronics design. Foldable phone hinge assemblies, true wireless earbud charging modules, wearable sensors and camera modules all rely on flex circuits because they bend, fold and…

Liquid Cooling and PCB Thermal Design in AI Servers Liquid cooling has moved from an optional upgrade to a default assumption in AI data centers during 2026. NVIDIA’s Vera Rubin platform has shifted entirely to liquid cooling, with company documentation stating that the Rubin generation of AI infrastructure operates with…

AI Chip Test Interfaces: Probe Cards and Burn-In Boards On September 10, 2026, supply chain reporting from DIGITIMES indicated that high end test interface capacity for AI chips remains tight. NVIDIA has reportedly locked up a substantial share of probe card and test socket capacity at major suppliers by paying…

Embedded Power Modules in PCB: SiC Packaging Moves On-Board Since the start of 2026, Silan Microelectronics has been building a patent portfolio around power module miniaturization, low stray inductance and embedded PCB structures. Records from the China National Intellectual Property Administration show that a design patent covering power devices for…

eVTOL Airworthiness: What PCBA Reliability Really Requires In September 2026, the low-altitude economy development conference held in Wuhu, Anhui brought together aircraft manufacturers, supply chain companies and research institutions to discuss eVTOL airworthiness, volume production and commercial operation. The 2026 China eVTOL Industry Development White Paper, released alongside the event,…