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HDI PCB Design Rules

LGA Assembly Without Solder Balls

  • By Frank guo
  • 2026年 9月 11日
  • PCB Assembly
  • No Comments
LGA Assembly Without Solder Balls What an LGA Package Is A land grid array package has a grid of flat pads on its underside instead of solder balls. The connection is formed entirely by the paste printed on the board, which melts, wets the package pads, and forms the joint.…
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BMS-control-board-battery-system

Embedded Components in PCB Builds

  • By Frank guo
  • 2026年 9月 11日
  • PCB Assembly
  • No Comments
Embedded Components in PCB Builds What Embedded Components Are An embedded component is a device that is placed inside the board rather than on its surface. The component, usually a thin passive or a small die, is mounted on an inner layer and then covered by the subsequent lamination so…
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Figure-5-Thick-copper-PCB

Solder Paste Jetting for Odd Shapes

  • By Frank guo
  • 2026年 9月 11日
  • PCB Assembly
  • No Comments
Solder Paste Jetting for Odd Shapes What Paste Jetting Is Solder paste jetting is a dispensing process that deposits paste onto a pad by firing a small droplet or a short pulse of material from a nozzle. There is no stencil, no squeegee, and no printing step. The machine moves…
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PCB Assembly

Press Fit Connectors in Assembly

  • By Frank guo
  • 2026年 9月 11日
  • PCB Assembly
  • No Comments
Press Fit Connectors in Assembly What a Press Fit Connection Is A press fit connector is attached to the board without solder. Each pin is a compliant metal shape that is slightly larger than the plated hole it enters, and pressing the pin into the hole deforms it so that…
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High Volume PCB Assembly

Castellated Holes for Module Edges

  • By Frank guo
  • 2026年 9月 11日
  • PCB Assembly
  • No Comments
Castellated Holes for Module Edges What Castellated Holes Are A castellated hole is a plated through hole that has been cut in half at the edge of the board, leaving a plated semicircular channel along the edge. The result is a connection that can be soldered flat onto a pad…
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Test coupon used for trace resistance measurement

Tented Vias and Solder Mask Coverage

  • By Frank guo
  • 2026年 9月 11日
  • PCB Assembly
  • No Comments
Tented Vias and Solder Mask Coverage What Tenting Means Tenting is the practice of covering a via opening with solder mask so that the hole is sealed by a film of mask rather than by a plug of material. The mask spans the opening and, in a well-made board, adheres…
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Factory Equipment Networking Box PCBA

Via Plugging and Filling Methods

  • By Frank guo
  • 2026年 9月 11日
  • PCB Assembly
  • No Comments
Via Plugging and Filling Methods Why Vias Are Plugged A via is a hole in the board, and an open hole causes problems after soldering. Solder paste can wick down the barrel and out the other side, leaving a starved joint on the surface and a blob of solder on…
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PCB Assembly Process

Solder Fillet Criteria for Inspection

  • By Frank guo
  • 2026年 9月 11日
  • PCB Assembly
  • No Comments
Solder Fillet Criteria for Inspection Why Fillet Criteria Exist The fillet is the visible part of a solder joint, and it is the only part an inspector can see. Criteria exist so that different inspectors, on different shifts, in different factories, reach the same conclusion about whether a joint is…
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Placement offset before and after self alignment on a reflowed PCB

Solder Pot Maintenance and Dross Control

  • By Frank guo
  • 2026年 9月 11日
  • PCB Assembly
  • No Comments
Solder Pot Maintenance and Dross Control Why Pot Condition Matters The solder pot is the reservoir that feeds every wave or fountain joint on the line, and its condition determines the quality of all of them. Alloy composition, temperature, and cleanliness change over time as the pot is used, and…
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Placement offset before and after self alignment on a reflowed PCB

Solder Paste Inspection on the Line

  • By Frank guo
  • 2026年 9月 11日
  • PCB Assembly
  • No Comments
Solder Paste Inspection on the Line What Paste Inspection Measures Solder paste inspection examines the printed deposits before components are placed, which makes it the earliest opportunity to catch a defect on the line. The system measures the height, area, and volume of each deposit and compares them with the…
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