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Production Handover and Documentation

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Production Handover and Documentation A production handover is the point at which a product moves from the people who developed it to the people who will build it every day. The information that changes hands at that moment determines whether the process runs or stalls. The handover is a document…

Functional Test Fixture Design for PCBA

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Functional Test Fixture Design for PCBA A functional test fixture connects the product to the test system, and every connection it makes has to be reliable, repeatable and harmless. The fixture is designed from the test requirement backwards, which is the opposite direction from the way a board is usually…

Thermal Vias Under Power Devices

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Thermal Vias Under Power Devices A power device on a surface pad has nowhere to send its heat except down through the board. Thermal vias carry it to the other side, and their number, size and construction decide how much of it arrives. How Heat Leaves the Pad The heat…

Pigtail and Drain Wire Practice for Shield Transfer Impedance

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Pigtail and Drain Wire Practice for Shield Transfer Impedance A screen around a cable is only as good as the way it is terminated. The shield intercepts the field that would otherwise couple onto the conductors inside it, and the current it collects has to be returned to a reference.…

Solder Mask Adhesion and Peel Strength Testing

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Solder Mask Adhesion and Peel Strength Testing Solder mask does more than colour a board. It separates adjacent conductors, keeps solder away from areas that must stay clean and protects the surface from contamination. All of those functions depend on one property: adhesion. A mask that lifts at the edge…

Solder Alloy and Flux Pairing

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Solder Alloy and Flux Pairing The alloy and the flux are chosen as a pair, because the flux has to remove the oxide at the temperature where the alloy melts. A pair that is mismatched produces joints that look acceptable and wet poorly, or a residue that cannot be qualified.…

Dry Pack Process Control

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Dry Pack Process Control Dry packing is the process of sealing moisture sensitive material in a barrier bag with desiccant so that the exposure clock stops. The controls are simple, and their failure is invisible until a package cracks at reflow. The process has three parts: the bag and its…

BGA Warpage and Solder Joint Open During Reflow

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

BGA Warpage and Solder Joint Open During Reflow A ball grid array package and the board it sits on both bend when they are heated, and they bend by different amounts. At the moment the alloy is molten the package and the board can be far enough apart to hold…

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Panel Size Selection and Material Utilization Guide

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

Panel Size Selection and Material Utilization Guide Panel size is one of the first decisions made about a job and one of the last to be questioned, yet it drives the material cost, the equipment the board can run on, the registration that can be held and the amount of…

False Calls: Preparation, Placement and Process Control

By Frank guo
2026年 9月 13日
PCB Assembly
No Comments

False Calls: Preparation, Placement and Process Control An automated optical inspection machine that flags every board is not a better inspector, it is a machine that will soon be disabled by the line. False calls cost rework labour, hide the real defects in a long queue of images and, in…

Production Handover and Documentation

Functional Test Fixture Design for PCBA

Thermal Vias Under Power Devices

Pigtail and Drain Wire Practice for Shield Transfer Impedance

Solder Mask Adhesion and Peel Strength Testing

Solder Alloy and Flux Pairing

Dry Pack Process Control

BGA Warpage and Solder Joint Open During Reflow

Panel Size Selection and Material Utilization Guide

False Calls: Preparation, Placement and Process Control

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