Package on Package Design Guide Package on package places a memory device on top of a logic device and connects the two through a ring of solder joints around the edge of the lower package. The arrangement saves board area and shortens the connection between the processor and its memory,…

PCB Lamination Specification: Writing It Down Precisely Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB lamination specification from the perspective of a PCBA factory floor, covering specifying…

PCB Lamination Handover: Passing It On Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB lamination handover from the perspective of a PCBA factory floor, covering handing over…

PCB Lamination Sample: Checking a Small Piece Modern electronics depend on boards that are assembled correctly the first time. Every product – a phone, a charger, a medical instrument or an industrial controller – relies on thousands of solder joints that must conduct current for years. This article explains PCB…

PCB Lamination Plan: Laying It Out First Modern electronics depend on boards that are assembled correctly the first time. Every product – a phone, a charger, a medical instrument or an industrial controller – relies on thousands of solder joints that must conduct current for years. This article explains PCB…

PCB Lamination Risks: What Could Go Wrong Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB lamination risks gives you a practical advantage when you choose…

PCB Lamination Review: A Second Look Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB lamination review gives you a practical advantage when you choose a…

Stencil Cleaning Frequency For Solder Paste Printing Stencil cleaning is one of the least visible steps in surface mount printing and one of the most influential. Paste left inside the apertures and on the underside of the foil changes the volume transferred at every subsequent print. The change is gradual,…

Reflow Oven Zone Balance And Profile Control A reflow oven is a series of heated zones along a conveyor, each holding a set temperature with its own airflow. The board absorbs heat as it passes, so the zones do not act independently. They interact through the thermal mass of the…

Counterfeit Components: Preparation, Placement and Process Control Counterfeit components reach production through the same channels that supply legitimate parts, and they are most likely to appear when a device is scarce, when a part has gone obsolete, or when a price is offered that is well below the market. The…