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Hand Soldering A Crystal Oscillator Without Hidden Damage

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Hand Soldering A Crystal Oscillator Without Hidden Damage A quartz crystal that oscillates correctly on the bench can still fail weeks later because of what happened during soldering. The damage is rarely a visible crack or a lifted pad. It is a slow shift in frequency, a rise in equivalent…
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Electronic Assembly

Solar Charge Controller Circuit Design

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Solar Charge Controller Circuit Design A solar panel produces a voltage that depends on the light and a current that depends on the load, and the product of the two is the power delivered. A charge controller sits between the panel and the battery and tries to keep that product…
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Our DIP Team at Work

Pick And Place Coordinate File Errors And How To Avoid Them

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Pick And Place Coordinate File Errors And How To Avoid Them A board can be electrically perfect and still stop a production line because the pick and place coordinate file is wrong. The machine does not read the schematic or the netlist; it reads a table of positions, and if…
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thernal-management

Laser Marking Serial Numbers on PCB Assemblies: Practical Notes

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Laser Marking Serial Numbers on PCB Assemblies: Practical Notes A serial number marked on the board is what allows a field failure to be traced back to a manufacturing lot, and laser marking has become the usual way of applying it because nothing touches the surface and nothing is consumed.…
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PCB Teardrop Application: Strengthening the Junction

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Teardrop Application: Strengthening the Junction Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB teardrop application gives you a practical advantage when you choose a…
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In-Circuit Test Versus Functional Test: Choosing the Right Gate

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
In-Circuit Test Versus Functional Test: Choosing the Right Gate In-circuit test and functional test answer two different questions, and the argument about which one to use is usually resolved by deciding what the factory needs to know when a board fails. One test tells you which component is wrong, and…
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In-System Programming in Production: Setup and Control

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
In-System Programming in Production: Setup and Control A board that leaves the assembly line without firmware is not a product. Programming has become part of the assembly process, and it introduces its own requirements on the layout, the test and the traceability. Where Programming Fits Programming can be performed before…
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Production Test Strategy: Choosing Between ICT, Flying Probe and Functional

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Production Test Strategy: Choosing Between ICT, Flying Probe and Functional Every test method detects a subset of the possible faults and costs a certain amount per board. A test strategy is the choice of which methods to use, in which order, and what to do with what they find. What…
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AI and Smart Factory in PCB Manufacturing

Reflow Preheat and Soak Zone Control for SMT Assembly

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Reflow Preheat and Soak Zone Control for SMT Assembly The first half of a reflow profile decides most of what happens in the second half. Preheat brings the assembly up to temperature without stressing it, and the soak zone gives flux time to activate and clean the surfaces before the…
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PCB Blind and Buried Vias: Holes That Do Not Show

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Blind and Buried Vias: Holes That Do Not Show Electronics manufacturing has become a discipline of small details. Solder paste volumes, placement accuracy, temperature profiles and inspection limits all add up to the final result. This guide looks at PCB blind and buried vias from the perspective of a…
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