Detail of electronic board, Macro with extremely shallow dof

High-Frequency Hybrid PCB Lamination Process Comparison

High-Frequency Hybrid PCB Lamination Process Comparison High-frequency products often mix FR-4 with low-loss or PTFE-based laminates in one stackup. This hybrid approach balances electrical performance against material cost. It also creates a bonding problem, because the materials expand, soften and flow at different rates. Lamination is where those differences either…