AI Server Substrates: What a 400 Billion Won Bet Signals Substrate capacity is now the constraint that decides how quickly AI accelerator packages can be built, and investment announcements are the clearest signal of where that capacity will sit. At the start of September 2026, a Korean substrate manufacturer signed…

Twenty to Forty Boards per Robot: Sizing the Humanoid PCB Market Industry analysis published in September 2026 reported that shipments of humanoid robots in China exceeded forty thousand units in the first half of the year, accounting for ninety-seven percent of the global total. The same analysis, drawing on a…

Multi-Layer FPC Reliability: Testing What Bending Actually Does Multi-layer flexible circuits have moved from simple single-sided ribbons to eight and twelve layer constructions used in folding phones, robotic joints, wearable medical devices and compact cameras. As layer count rises, the circuit takes on the electrical complexity of a rigid board…

LPDDR6 Memory: Why Faster RAM Pushes the PCB Process At the end of August 2026 a Chinese memory manufacturer announced volume production of LPDDR6, and a domestic flagship processor was named as the first to support it, with a folding phone expected to launch the combination. Reported specifications include a…

Cavity PCB: The Three-Dimensional Board Behind Small Modules Market research published in August 2026 estimated the global cavity printed circuit board market at approximately 7.616 billion United States dollars in 2025, rising to a projected 14.47 billion dollars by 2032, a compound annual growth rate of about 9.2 percent. The…

Laser Drilling in HDI: Why Microvias Are the Hard Part Mechanical drilling stops being practical at a certain via size. A carbide bit below a tenth of a millimetre becomes fragile, wanders in the hole, and cannot be replaced in time without slowing production to a crawl. Below that threshold,…

Auditing an HDI Supplier: What the Checklist Should Contain High-density interconnect boards are used wherever space is scarce and signal density is high: smartphones, wearable devices, AI server boards, automotive controllers and increasingly portable medical equipment. The common characteristic is that line width, spacing and via size are all smaller…

PCB Industry Past 100 Billion Dollars: Where the Growth Comes From Industry analysis published in September 2026 estimated global printed circuit board output at 92.36 billion United States dollars in 2025, an increase of 15.4 percent, and projected 105.2 billion dollars in 2026, growth of 13.9 percent, taking the industry…

CoWoS Expansion: What Substrate Capacity Means for PCB Suppliers At the start of September 2026, reports described monthly output of one hundred and thirty thousand units behind the expansion of chip-on-wafer-on-substrate capacity, and separately indicated that a leading foundry is widening the scope of work outsourced to packaging and test…

60-Layer PCB Manufacturing: What Ultra-High Layer Counts Take In its half-year report published at the end of August 2026, a Chinese board manufacturer disclosed that it had qualified M8 and M9 grade ultra-low-loss materials, completed certification for fifty-layer technology, reached a maximum capability of sixty layers, and validated multi-order HDI…