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PCB Manufacturing

PCB Soft Gold Versus Hard Gold: Two Golds for Two Jobs

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Soft Gold Versus Hard Gold: Two Golds for Two Jobs Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB soft gold versus hard gold gives…
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5G PCB

PCB Hardware Design Flow: From Requirements to Release

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Hardware Design Flow: From Requirements to Release Most hardware projects that run late were not derailed by a difficult circuit. They were derailed by a step that was skipped, compressed or done out of order, and the cost of that omission appeared only at the prototype stage. A defined…
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SMT Team in Action

High Speed PCB Layout: Floorplanning and Routing Order

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
High Speed PCB Layout: Floorplanning and Routing Order High speed design is often discussed as a list of routing rules, but most of the difficulty appears earlier, when the floorplan and the routing order are decided. Two boards with the same stackup and the same components can differ by a…
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ISO13485

Carbon Ink PCB: Conductive Printing for Contacts and Jumpers

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Carbon Ink PCB: Conductive Printing for Contacts and Jumpers Carbon ink is one of the quiet workhorses of a board. It appears as a black rectangle on the contacts of a keypad, as a short link across two nets that must be joined without a resistor, and as the resistive…
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Through-Hole-PCB-Assembly2

Overmolding PCB Design: Encapsulation and Material Choice

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Overmolding PCB Design: Encapsulation and Material Choice Overmolding turns a circuit board into a sealed component. Instead of a housing with a board inside it, the board is placed in a mold and plastic or a soft encapsulant is formed around it, so the finished part is a single sealed…
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Multilayer PCB

Thermal Management in PCB Design: Keeping Parts Cool

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Thermal Management in PCB Design: Keeping Parts Cool Every watt dissipated on a board has to leave it, and the path it takes is decided by the layout rather than by the schematic. A regulator that runs cool in free air can exceed its limit inside a sealed enclosure simply…
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PCB_test

PCB Matte Versus Glossy Solder Mask: How the Board Looks

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Matte Versus Glossy Solder Mask: How the Board Looks Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB matte versus glossy solder mask gives you…
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Rigid-Flex PCB

PCB Hard Gold on A Connector: Gold That Has to Be Touched

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Hard Gold on A Connector: Gold That Has to Be Touched Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB hard gold on a connector…
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17

Component Sourcing and Counterfeit Avoidance

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Component Sourcing and Counterfeit Avoidance The parts on a board decide whether the product works, and the parts that arrive at the assembly house decide whether the design can be built twice the same way. Component sourcing is therefore a design and engineering activity, not an administrative one, and the…
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6-2

18-Layer Rigid Flex PCB Cost: Prototype to Volume

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
18-Layer Rigid Flex PCB Cost: Prototype to Volume An eighteen layer rigid flex board sits at the top of the interconnect difficulty scale. It combines the lamination complexity of a very high layer count rigid board with the material handling requirements of flexible circuits, and it is usually built because…
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