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Layer Lamination

Print Head Technology in SMT Printing

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Print Head Technology in SMT Printing The print head is the part of a stencil printer that turns paste into a deposit. It carries the squeegee, applies the force and moves across the stencil, and the way it does those three things sets the fill of the aperture and the…
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PCB assembly

Backdrilling And Stub Removal In High Speed Boards

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Backdrilling And Stub Removal In High Speed Boards A plated through hole that only needs to connect the outer layers still passes through the whole board, and the unused portion below the last connected layer is called a stub. At high frequencies the stub behaves as a resonant transmission line…
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quick-turn-pcb

PCB Soldermask Data: What the Numbers Say

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Soldermask Data: What Matters on the Production Line Modern electronics depend on boards that are assembled correctly the first time. Every product – a phone, a charger, a medical instrument or an industrial controller – relies on thousands of solder joints that must conduct current for years. This article…
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BGA

PCB Soldermask Plan: Laying It Out First

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Soldermask Plan: What Matters on the Production Line Buyers and engineers often focus on the finished product and forget the production line behind it. In practice, most field failures can be traced back to process decisions made during assembly. Understanding PCB soldermask plan gives you a practical advantage when…
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Electronics Manufacturing with Full Product Traceability

Ionic Contamination: Preparation, Placement and Process Control

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Ionic Contamination: Preparation, Placement and Process Control Ionic contamination is the residue of the soldering process that remains on the board in the form of dissolved salts and flux activators. It is conductive once it absorbs moisture, and it is the raw material for leakage currents and for electrochemical migration…
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High Volume PCB Assembly

Surface Insulation Resistance Test On Assemblies

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Surface Insulation Resistance Test On Assemblies Surface insulation resistance is a measure of how well a surface resists the flow of leakage current between two conductors. On an assembled board it is affected by the flux residue left behind, by the cleanliness of the process and by the humidity of…
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射频PCB

PCB Soldermask Standards: Agreeing the Rules

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Soldermask Standards: Agreeing the Rules Soldermask looks like a cosmetic layer until a defect reaches the assembly line. A mask that lifts, cracks or traps flux can block a pad, shift a joint or fail a cleanliness check. The rules that govern mask quality are rarely argued at the…
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High-Speed PCB

Solder Paste Inspection Guide

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Solder Paste Inspection Guide Solder paste inspection measures the deposit on every pad before a component is placed. It measures a process that has no other in line check, and it does so at the point where a correction is still cheap, which is why the data is more valuable…
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product image

Stencil Cleaning Methods Compared

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Stencil Cleaning Methods Compared A stencil collects paste on both faces during a print run. The underside picks up paste that is squeezed under the foil and the apertures collect paste on their walls, and both of them change the deposit. Stencil cleaning is therefore a continuous process rather than…
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Solar Inverter System PCBA

PCB Soldermask Limits: Where the Edges Are

  • By 杰夫
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Soldermask Limits: Where the Edges Are Soldermask is not a coating that simply covers a board. It defines where solder may land, where copper stays protected and where the circuit must stay clear. The limits around those edges decide whether a design builds cleanly at volume. This review sets…
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Recent Posts

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Zane Zhang - 2026年 10月 2日
Cheap PCB Costs: PCB Design, PCB Manufacturing & SMT vs TH Guide

Cheap PCB Costs: PCB Design, PCB Manufacturing & SMT vs TH Guide

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