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PCB Prototype Assembly

Solder Mask Thickness and Coverage Specification Guide

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Solder Mask Thickness and Coverage Specification Guide Solder mask is the thin polymer skin that decides where solder may flow and where copper must stay sealed. Designers often specify a colour and move on, yet solder mask thickness and coverage quietly influence yield, impedance, and long-term reliability. This guide walks…
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relax_now

Tombstoning in SMT Assembly: Causes and Prevention

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Tombstoning in SMT Assembly: Causes and Prevention Tombstoning is one of the most visible defects on an SMT line: a chip resistor or capacitor lifts on one end and stands upright after reflow. The mechanism is mechanical rather than chemical, and it almost always comes from an imbalance between the…
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19

Surface Finish Selection: ENIG, OSP and Hard Gold

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Surface Finish Selection: ENIG, OSP and Hard Gold Surface finish is the last hundred nanometres of a board and one of the first things to go wrong in production. It decides whether a pad still wets after six months in storage, whether a fine pitch array solders without voids, and…
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Automotive PCB

PCB Prototyping and Production: Key Issues to Resolve

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
PCB Prototyping and Production: Key Issues to Resolve Most of the cost and delay in a new board comes from decisions taken before the first order is placed. A prototype that is released with an unresolved question about the stackup, the connector or the test method will come back with…
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Industrial-5G-Networking-Equipment-PCBA

Imaging Equipment PCB Design: Signal Integrity and Thermal Design Together

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Imaging Equipment PCB Design: Signal Integrity and Thermal Design Together Imaging equipment concentrates several difficult requirements into one board. It has a sensitive analogue front end handling small signals, a high speed digital section moving large amounts of data, and power conversion for the detectors and the interface, often inside…
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Industrial-IOT—PCBA

Soldering Flux Residue Removal and Board Cleaning Guide

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Soldering Flux Residue Removal and Board Cleaning Guide Flux is essential to a sound solder joint, yet what it leaves behind can matter just as much as the metal it helped fuse. Once the reflow or wave cycle ends, flux residue sits on pads, under components, and inside vias, where…
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ptt_project

Industrial Control Board Fabrication Flow and Process Standards

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Industrial Control Board Fabrication Flow and Process Standards Industrial control boards occupy an awkward position between consumer electronics and dedicated industrial hardware. They are produced in modest volumes, they run continuously for years, and they are often installed in cabinets where the temperature swings from a cold morning to a…
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Future Trends in Autonomous Vehicle Control PCBs

Why a 4.7k Resistor Still Sets Signal Chain Accuracy

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Why a 4.7k Resistor Still Sets Signal Chain Accuracy Some passive components appear in so many designs that engineers stop reading their datasheets. The 4.7k resistor is one of them, and that is precisely what makes it worth a second look. It is the conventional pull-up value for an I2C…
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Dust extraction system on a PCB drilling machine

LoRa Module PCB Integration: Space, SPI and Antenna

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
LoRa Module PCB Integration: Space, SPI and Antenna Adding a long range radio to a compact sensor node looks simple on a block diagram and turns awkward as soon as the enclosure is fixed. The radio needs a supply that does not sag during transmit bursts, a digital link to…
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PCB pad design

Copper Grain Structure and Annealing in PCB Plating

  • By Frank guo
  • 2026年 9月 13日
  • PCB Assembly
  • No Comments
Copper Grain Structure and Annealing in PCB Plating Plated copper carries nearly every signal and every ampere on a modern board, yet it is rarely treated as a material with a microstructure. Grain size, orientation, and impurity content decide whether a via barrel survives thermal cycling or cracks on the…
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