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copper electroplating of a PCB panel on a plating line

SMT Chip Thrust Test and Assembly Strength Guide | gopcb

  • By 杰夫
  • 2026年 9月 7日
  • PCB Assembly
  • No Comments
SMT Chip Thrust Test and Assembly Strength Guide The SMT chip thrust test measures the adhesion strength and soldering fastness of surface mount components on a PCB. It is also called a shear test. The test applies a controlled force to the side of a component until the solder joint…
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Polyimide PCB

Burn In Board PCB Guide: Design, Materials, Process and Cost

  • By Frank guo
  • 2026年 9月 7日
  • PCB Assembly
  • No Comments
Burn In Board PCB Guide: Design, Materials, Process and Cost What a Burn In Board Is A semiconductor burn in board, often called a burn-in board, is a high performance PCB that carries chips through accelerated reliability testing. The board is installed inside a burn-in oven or an ATE system,…
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Surface of a laminated panel showing visible glass weave

Improve SMT Production Line Throughput: Placement Optimization | gopcb

  • By 杰夫
  • 2026年 9月 7日
  • PCB Assembly
  • No Comments
Improve SMT Production Line Throughput: Placement Optimization SMT production line throughput is usually limited by the placement machine. The printer, mounter, and reflow oven must work at a balanced speed so that no single machine waits for another. Improving throughput is not only about buying a faster mounter; it also…
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high Tg PCB

20-Layer ABF Substrate Guide: Structure, Materials, Process and Cost

  • By Frank guo
  • 2026年 9月 7日
  • PCB Assembly
  • No Comments
20-Layer ABF Substrate Guide: Structure, Materials, Process and Cost What a 20-Layer ABF Substrate Is A 20-layer ABF substrate is a high density IC package substrate built with ABF build-up film as the dielectric, used to connect a semiconductor die to the PCB motherboard. AI processors, GPUs, CPUs, FPGAs, ASICs…
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Microsection of a multilayer board under a microscope

SMT PCB Assembly Process Control: Error Prevention Guide | gopcb

  • By 杰夫
  • 2026年 9月 7日
  • PCB Assembly
  • No Comments
SMT PCB Assembly Process Control: Error Prevention Guide SMT PCB assembly process control measures are defined for every step from solder paste application to component placement and reflow soldering. SMT is a popular assembly technology because it allows high density and fast production, but it can only produce reliable boards…
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PCB dimensions

BGA Reballing Guide: Process, Equipment, IPC Standards and Cost

  • By Frank guo
  • 2026年 9月 7日
  • PCB Assembly
  • No Comments
BGA Reballing Guide: Process, Equipment, IPC Standards and Cost What BGA Reballing Is BGA reballing is the professional rework process of removing a ball grid array chip from a board, stripping the old solder balls from its underside, attaching a fresh set of uniform balls and re-soldering the component back…
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Placement accuracy verification after head calibration

Manual and Automatic SMT Assembly: Process Guide | gopcb

  • By 杰夫
  • 2026年 9月 7日
  • PCB Assembly
  • No Comments
Manual and Automatic SMT Assembly: Process Guide Manual and automatic SMT assembly are used together in a modern PCBA factory. Automatic pick-and-place machines place surface mount components at high speed, while manual methods remain useful for through-hole parts, prototypes, and small production quantities. The factory chooses the correct method for…
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high‑reliability PCBs

PCB Dimensions Guide: Board Size, Thickness and Tolerance Standards

  • By Frank guo
  • 2026年 9月 7日
  • PCB Assembly
  • No Comments
PCB Dimensions Guide: Board Size, Thickness and Tolerance Standards What PCB Dimensions Really Include PCB dimensions are the complete set of mechanical parameters that define a bare board, not just its length and width. A full dimension set covers the board outline, the finished thickness, the copper weight on each…
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microsection of a plated through hole wall

SMT Mounting Principle: Placement Machine Mechanics | gopcb

  • By 杰夫
  • 2026年 9月 7日
  • PCB Assembly
  • No Comments
SMT Mounting Principle: Placement Machine Mechanics The SMT mounting principle explains how a placement machine picks a component from its feeder, verifies its position, and places it exactly on the pad of a PCB. SMT stands for surface mount technology, and the mounting machine is the key equipment that performs…
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Placement offset before and after self alignment on a reflowed PCB

PCB In Circuit Test (ICT) Guide: Process, Fixtures and Costs

  • By Frank guo
  • 2026年 9月 7日
  • PCB Assembly
  • No Comments
PCB In Circuit Test (ICT) Guide: Process, Fixtures and Costs What PCB In Circuit Test (ICT) Means PCB in circuit test, usually shortened to ICT, is an automated electrical test applied to an assembled board to verify that every component is present, correctly placed, correctly valued and properly connected before…
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