Laser Drilling in HDI: Why Microvias Are the Hard Part Mechanical drilling stops being practical at a certain via size. A carbide bit below a tenth of a millimetre becomes fragile, wanders in the hole, and cannot be replaced in time without slowing production to a crawl. Below that threshold,…

Auditing an HDI Supplier: What the Checklist Should Contain High-density interconnect boards are used wherever space is scarce and signal density is high: smartphones, wearable devices, AI server boards, automotive controllers and increasingly portable medical equipment. The common characteristic is that line width, spacing and via size are all smaller…

PCB Industry Past 100 Billion Dollars: Where the Growth Comes From Industry analysis published in September 2026 estimated global printed circuit board output at 92.36 billion United States dollars in 2025, an increase of 15.4 percent, and projected 105.2 billion dollars in 2026, growth of 13.9 percent, taking the industry…

CoWoS Expansion: What Substrate Capacity Means for PCB Suppliers At the start of September 2026, reports described monthly output of one hundred and thirty thousand units behind the expansion of chip-on-wafer-on-substrate capacity, and separately indicated that a leading foundry is widening the scope of work outsourced to packaging and test…

60-Layer PCB Manufacturing: What Ultra-High Layer Counts Take In its half-year report published at the end of August 2026, a Chinese board manufacturer disclosed that it had qualified M8 and M9 grade ultra-low-loss materials, completed certification for fifty-layer technology, reached a maximum capability of sixty layers, and validated multi-order HDI…

High-Volume PCB Assembly refers to the production of large quantities of assembled printed circuit boards using highly controlled and repeatable manufacturing processes. There is no universal production quantity that officially defines high-volume PCB assembly. Depending on the manufacturer, industry, and product type, high-volume production may range from several thousand units…

Electronic components are available in a wide range of sizes, shapes, packages, and electrical specifications. Even the same type of integrated circuit (IC) can be manufactured in several package configurations to meet different electrical, mechanical, thermal, and assembly requirements. When designing a printed circuit board (PCB), two major component mounting…

I-Tera MT40 PCB: PCB Design, PCB Manufacturing, High-Speed & RF Applications As electronic systems continue to demand higher data rates, greater efficiency, lower signal loss, and improved reliability, advanced PCB materials have become increasingly important. Conventional FR-4 materials remain suitable for a wide range of applications, but demanding high-speed digital,…

Surface Mount Technology (SMT) has become the dominant technology in modern PCB assembly, enabling manufacturers to build smaller, lighter, faster, and more reliable electronic products. Unlike traditional Through-Hole Technology (THT), SMT mounts components directly onto the surface of a printed circuit board (PCB), eliminating the need for most component lead…

When developing a new electronic product, it is often difficult to identify every design or manufacturing issue before physical hardware is built. Producing a small number of assembled boards allows engineers to verify the design, evaluate component performance, identify manufacturing problems, and make improvements before committing to larger production volumes.…